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CY7C1303V25-200BZC PDF预览

CY7C1303V25-200BZC

更新时间: 2024-09-13 21:19:15
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
28页 231K
描述
QDR SRAM, 1MX18, 2.3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, FBGA-165

CY7C1303V25-200BZC 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:13 X 15 MM, 1.40 MM HEIGHT, FBGA-165针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.88
最长访问时间:2.3 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):200 MHzI/O 类型:SEPARATE
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:15 mm内存密度:18874368 bit
内存集成电路类型:QDR SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:165字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):220电源:1.5/1.8,2.5 V
认证状态:Not Qualified座面最大高度:1.4 mm
最小待机电流:2.4 V子类别:SRAMs
最大供电电压 (Vsup):2.6 V最小供电电压 (Vsup):2.4 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:13 mm
Base Number Matches:1

CY7C1303V25-200BZC 数据手册

 浏览型号CY7C1303V25-200BZC的Datasheet PDF文件第2页浏览型号CY7C1303V25-200BZC的Datasheet PDF文件第3页浏览型号CY7C1303V25-200BZC的Datasheet PDF文件第4页浏览型号CY7C1303V25-200BZC的Datasheet PDF文件第5页浏览型号CY7C1303V25-200BZC的Datasheet PDF文件第6页浏览型号CY7C1303V25-200BZC的Datasheet PDF文件第7页 
y
yy yy  
CY7C1303V25  
CY7C1306V25  
Preliminary  
18 Mb Burst of 2 Pipelined SRAM with QDR Architecture  
Features  
Functional Description  
• Separate Independent Read and Write Data Ports  
— Supports concurrent transactions  
• 167 MHz Clock for High Bandwidth  
— 2.5 ns Clock-to-Valid access time  
• 2-Word Burst on all accesses  
• DoubleDataRate(DDR)interfacesonbothRead&Write  
Ports (data transferred at 333 MHz) @167 MHz  
• Two input clocks (K and K) for precise DDR timing  
— SRAM uses rising edges only  
• Two output clocks (C and C) accounts for clock skew  
and flight time mis-matches  
• Single multiplexed address input bus latches address  
inputs for both READ and WRITE ports  
• Separate Port Selects for depth expansion  
• Synchronous internally self-timed writes  
• 2.5V core power supply with HSTL Inputs and Outputs  
The CY7C1303V25 and CY7C1306V25 are 2.5V Synchro-  
nous Pipelined SRAMs equipped with QDR architecture. QDR  
architecture consists of two separate ports to access the mem-  
ory array. The Read port has dedicated Data Outputs to sup-  
port Read operations and the Write Port has dedicated Data  
inputs to support Write operations. Access to each port is ac-  
complished through a common address bus. The Read ad-  
dress is latched on the rising edge of the K clock and the Write  
address is latched on the rising edge of K clock. QDR has  
separate data inputs and data outputs to completely eliminate  
the need to “turn-around” the data bus required with common  
I/O devices. Accesses to the CY7C1303V25/CY7C1306V25  
Read and Write ports are completely independent of one an-  
other. All accesses are initiated synchronously on the rising  
edge of the positive input clock (K). In order to maximize data  
throughput, both Read and Write ports are equipped with Dou-  
ble Data Rate (DDR) interfaces. Therefore, data can be trans-  
ferred into the device on every rising edge of both input clocks  
(K and K) and out of the device on every rising edge of the  
output clock (C and C) thereby maximizing performance while  
simplifying system design. Each address location is associat-  
ed with two 18-bit words (CY7C1303V25) or two 36-bit words  
(CY7C1306V25) that burst sequentially into or out of the de-  
vice.  
• 13x15 mm 1.0 mm pitch fBGA package, 165 ball  
(11x15 matrix) Variable drive HSTL output buffers  
• Expanded HSTL output voltage (1.4V–1.9V)  
• JTAG Interface  
• Variable Impedance HSTL  
Configurations  
CY7C1303V25 – 1 Mb x 18  
CY7C1306V25 – 512K x 36  
Depth expansion is accomplished with a Port Select input for  
each port. Each Port Selects allow each port to operate inde-  
pendently.  
All synchronous inputs pass through input registers controlled  
by the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C input clocks. Writes are con-  
ducted with on-chip synchronous self-timed write circuitry.  
Logic Block Diagram (CY7C1303V25)  
D[17:0]  
18  
Write  
Write  
Data Reg  
Data Reg  
Address  
Register  
A
(18:0)  
Address  
Register  
A(18:0)  
19  
19  
512Kx18 512Kx18  
Memory Memory  
Array  
Array  
K
CLK  
Gen.  
RPS  
Control  
Logic  
K
C
C
Read Data Reg.  
36  
18  
Vref  
18  
Reg.  
Reg.  
Reg.  
18  
18  
Control  
Logic  
WPS  
BWS0  
18  
Q[17:0]  
BWS1  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05100 Rev. *A  
Revised December 11, 2002  

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