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CY7C1304V25-167BZC PDF预览

CY7C1304V25-167BZC

更新时间: 2024-09-15 20:11:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
24页 406K
描述
QDR SRAM, 128KX72, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165

CY7C1304V25-167BZC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LBGA, BGA165,11X15,40
针数:165Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.88最长访问时间:2.5 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):167 MHz
I/O 类型:SEPARATEJESD-30 代码:R-PBGA-B165
JESD-609代码:e0长度:15 mm
内存密度:9437184 bit内存集成电路类型:QDR SRAM
内存宽度:72功能数量:1
端口数量:2端子数量:165
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX72
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.5/1.8,2.5 V认证状态:Not Qualified
座面最大高度:1.36 mm最大待机电流:0.1 A
最小待机电流:2.4 V子类别:SRAMs
最大压摆率:0.45 mA最大供电电压 (Vsup):2.6 V
最小供电电压 (Vsup):2.4 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:13 mmBase Number Matches:1

CY7C1304V25-167BZC 数据手册

 浏览型号CY7C1304V25-167BZC的Datasheet PDF文件第2页浏览型号CY7C1304V25-167BZC的Datasheet PDF文件第3页浏览型号CY7C1304V25-167BZC的Datasheet PDF文件第4页浏览型号CY7C1304V25-167BZC的Datasheet PDF文件第5页浏览型号CY7C1304V25-167BZC的Datasheet PDF文件第6页浏览型号CY7C1304V25-167BZC的Datasheet PDF文件第7页 
CY7C1304V25  
9-Mb Pipelined SRAM with QDR™ Architecture  
Features  
Functional Description  
• Separate independent Read and Write data ports  
— Supports concurrent transactions  
The CY7C1304V25 is a 2.5V Synchronous Pipelined SRAM  
equipped with QDR architecture. QDR architecture consists of  
two separate ports to access the memory array. The Read port  
has dedicated Data Outputs to support Read operations and  
the Write Port has dedicated Data Inputs to support Write op-  
erations. QDR architecture has separate data inputs and data  
outputs to completely eliminate the need to turn-aroundthe  
data bus required with common I/O devices. Access to each  
port is accomplished through a common address bus. Ad-  
dresses for Read and Write addresses are latched on alter-  
nate rising edges of the input (K)[1] clock. Accesses to the  
CY7C1304V25 Read and Write ports are completely indepen-  
dent of one another. In order to maximize data throughput,  
both Read and Write ports are equipped with Double Data  
Rate (DDR) interfaces. Each address location is associated  
with 4 18-bit words that burst sequentially into or out of the  
device. Since data can be transferred into and out of the de-  
vice on every rising edge of both input clocks (K/K[1] and C/C)  
memory bandwidth is maximized while simplifying system de-  
sign by eliminating bus turn-arounds.  
• 167 MHz Clock for high bandwidth  
— 2.5 ns Clock-to-Valid access time  
• 4-Word burst for reducing address bus frequency  
• DoubleDataRate(DDR)interfacesonbothRead&Write  
Ports (data transferred at 333 MHz) @167 MHz  
• Two input clocks (K and K)[1] for precise DDR timing  
— SRAM uses rising edges only  
• Two output clocks (C and C) accounts for clock skew  
and flight time mis-matches  
• Single multiplexed address input bus latches address  
inputs for both READ and WRITE ports  
• Separate Port Selects for depth expansion  
• Synchronous internally self-timed writes  
• 2.5VcorepowersupplywithHSTLInputsandOutputs[1]  
• 13x15 mm 1.0 mm pitch fBGA package, 165 ball (11x15  
matrix)  
• Variable drive HSTL output buffers  
• Expanded HSTL output voltage (1.4V-1.9V)  
• JTAG Interface  
Depth expansion is accomplished with Port Selects for each  
port. Port selects allow each port to operate independently.  
All synchronous inputs pass through input registers controlled  
by the K or K[1] input clocks. Data outputs pass through output  
registers controlled by the C or C input clocks. Writes are con-  
ducted with on-chip synchronous self-timed write circuitry.  
Logic Block Diagram  
D
[17:0]  
18  
Write Write Write  
Write  
Reg Reg Reg Reg  
Address  
Register  
A
Address  
Register  
(16:0)  
A
(16:0)  
17  
17  
[1]  
[1]  
K
K
CLK  
Gen.  
RPS  
Control  
Logic  
C
C
Read Data Reg.  
72  
36  
Vref  
Reg.  
Reg.  
Reg.  
18  
WPS  
BWS  
Control  
Logic  
36  
[0:1]  
Q
[17:0]  
18  
Selection Guide  
7C1304V25-167  
7C1304V25-133  
7C1304V25-100  
Maximum Operating Frequency (MHz)  
167  
450  
133  
350  
100  
230  
Maximum Operating Current (mA)  
Note:  
1. K and K inputs require VIH to be greater than VREF + 0.5V and VIL to be less than VREF - 0.5. This is a subset of JEDEC standards for HSTL I/Os.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05167 Rev. *A  
Revised August 15, 2002  

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