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CY7C1041CV33-8ZSXI PDF预览

CY7C1041CV33-8ZSXI

更新时间: 2024-12-01 21:12:55
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
17页 350K
描述
Standard SRAM, 256KX16, 8ns, CMOS, PDSO44, LEAD FREE, TSOP2-44

CY7C1041CV33-8ZSXI 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2,
针数:44Reach Compliance Code:compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:7.93最长访问时间:8 ns
JESD-30 代码:R-PDSO-G44JESD-609代码:e4
长度:18.415 mm内存密度:4194304 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:44字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.194 mm最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):2.97 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:10.16 mmBase Number Matches:1

CY7C1041CV33-8ZSXI 数据手册

 浏览型号CY7C1041CV33-8ZSXI的Datasheet PDF文件第2页浏览型号CY7C1041CV33-8ZSXI的Datasheet PDF文件第3页浏览型号CY7C1041CV33-8ZSXI的Datasheet PDF文件第4页浏览型号CY7C1041CV33-8ZSXI的Datasheet PDF文件第5页浏览型号CY7C1041CV33-8ZSXI的Datasheet PDF文件第6页浏览型号CY7C1041CV33-8ZSXI的Datasheet PDF文件第7页 
CY7C1041CV33  
4-Mbit (256 K × 16) Static RAM  
4-Mbit (256  
K × 16) Static RAM  
Features  
Functional Description  
Temperature ranges  
Industrial: –40 °C to 85 °C  
The CY7C1041CV33 is a high performance CMOS static RAM  
organized as 262,144 words by 16 bits.  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data  
from I/O pins (/IO0 through I/O7), is written into the location  
specified on the address pins (A0 through A17). If Byte High  
Pin and function compatible with CY7C1041BV33  
High speed  
tAA = 8 ns  
Enable (BHE) is LOW, then data from IO pins (I/O8 through I/O15  
)
Low active power  
360 mW (max)  
is written into the location specified on the address pins (A0  
through A17).  
2.0 V data retention  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If  
Byte Low Enable (BLE) is LOW, then data from the memory  
location specified by the address pins appear on I/O0 to I/O7. If  
Byte High Enable (BHE) is LOW, then data from memory  
appears on I/O8 to I/O15. For more information, see the Truth  
Table on page 10 for a complete description of Read and Write  
modes.  
Automatic power down when deselected  
TTL-compatible inputs and outputs  
Easy memory expansion with CE and OE features  
Available in Pb-free 44-pin TSOP II package  
The input and output pins (I/O0 through I/O15) are placed in a  
high impedance state when the device is deselected (CE HIGH),  
the outputs are disabled (OE HIGH), the BHE and BLE are  
disabled (BHE, BLE HIGH), or during a write operation (CE LOW  
and WE LOW).  
For a complete list of related documentation, click here.  
Logic Block Diagram  
INPUT BUFFER  
A
A
0
1
A
A
A
A
2
3
4
5
256K x 16  
RAM Array  
I/O –I/O  
0
7
A
A
A
6
7
8
I/O –I/O  
8
15  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 38-05134 Rev. *R  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 9, 2017  
 
 

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