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CY7C1041DV33-12BVXE PDF预览

CY7C1041DV33-12BVXE

更新时间: 2024-01-29 20:12:21
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
14页 401K
描述
4-Mbit (256K x 16) Static RAM

CY7C1041DV33-12BVXE 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2, TSOP44,.46,32针数:44
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.78
最长访问时间:12 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-G44JESD-609代码:e4
长度:18.415 mm内存密度:4194304 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:44字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-40 °C
组织:256KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP44,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified筛选级别:AEC-Q100
座面最大高度:1.194 mm最大待机电流:0.015 A
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.095 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:20
宽度:10.16 mmBase Number Matches:1

CY7C1041DV33-12BVXE 数据手册

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CY7C1041DV33  
4-Mbit (256K x 16) Static RAM  
Features  
Functional Description[1]  
• Pin- and function-compatible with CY7C1041CV33  
• High speed  
The CY7C1041DV33 is a high-performance CMOS Static  
RAM organized as 256K words by 16 bits. Writing to the device  
is accomplished by taking Chip Enable (CE) and Write Enable  
(WE) inputs LOW. If Byte LOW Enable (BLE) is LOW, then  
data from I/O pins (I/O0–I/O7), is written into the location  
specified on the address pins (A0–A17). If Byte HIGH Enable  
(BHE) is LOW, then data from I/O pins (I/O8–I/O15) is written  
into the location specified on the address pins (A0–A17).  
— tAA =10 ns  
• Low active power  
— ICC = 90 mA @ 10 ns (Industrial)  
• Low CMOS standby power  
— ISB2 = 10 mA  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte LOW Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O0 – I/O7. If Byte HIGH Enable (BHE) is  
LOW, then data from memory will appear on I/O8 to I/O15. See  
the truth table at the back of this data sheet for a complete  
description of Read and Write modes.  
• 2.0 V data retention  
• Automatic power-down when deselected  
• TTL-compatible inputs and outputs  
• Easy memory expansion with CE and OE features  
• Available in lead-free 48-ball VFBGA, 44-lead (400-mil)  
Molded SOJ and 44-pin TSOP II packages  
The input/output pins (I/O0–I/O15  
)
are placed in  
a
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE  
are disabled (BHE, BLE HIGH), or during a Write operation  
(CE LOW, and WE LOW).  
The CY7C1041DV33 is available in a standard 44-pin  
400-mil-wide body width SOJ and 44-pin TSOP II package  
with center power and ground (revolutionary) pinout, as well  
as a 48-ball fine-pitch ball grid array (FBGA) package.  
Logic Block Diagram  
INPUT BUFFER  
A
0
A
1
A
2
I/O –I/O  
0
7
A
3
4
A
256K × 16  
A
6
I/O –I/O  
5
8
15  
A
A
7
8
A
COLUMN  
DECODER  
BHE  
WE  
CE  
OE  
BLE  
Note  
1. For guidelines on SRAM system design, please refer to the “System Design Guidelines” Cypress application note, available on the internet at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05473 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised July 17, 2006  
[+] Feedback  

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