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CY7C1041DV33-10ZSXC PDF预览

CY7C1041DV33-10ZSXC

更新时间: 2024-12-01 13:07:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
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CY7C1041DV33-10ZSXC 数据手册

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CY7C1041DV33  
4-Mbit (256 K × 16) Static RAM  
4-Mbit (256  
K × 16) Static RAM  
Features  
Functional Description  
Temperature ranges  
The CY7C1041DV33 is a high performance CMOS Static RAM  
organized as 256 K words by 16-bits. To write to the device, take  
chip enable (CE) and write enable (WE) inputs LOW. If byte low  
enable (BLE) is LOW, then data from I/O pins (I/O0 to I/O7) is  
written into the location specified on the address pins (A0 to A17).  
If byte high enable (BHE) is LOW, then data from I/O pins (I/O8  
to I/O15) is written into the location specified on the address pins  
(A0 to A17).  
Industrial: –40 °C to 85 °C  
Automotive-A [1] : –40 °C to 85 °C  
Automotive-E [1] : –40 °C to 125 °C  
Pin and function compatible with CY7C1041CV33  
High speed  
tAA = 10 ns  
To read from the device, take chip enable (CE) and output enable  
(OE) LOW while forcing the write enable (WE) HIGH. If BLE is  
LOW, then data from the memory location specified by the  
address pins appears on I/O0 to I/O7. If BHE is LOW, then data  
from memory appears on I/O8 to I/O15. See the Truth Table on  
page 10 for a complete description of read and write modes.  
Low active power  
ICC = 90 mA at 10 ns (industrial)  
Low CMOS standby power  
ISB2 = 10 mA  
2.0 V data retention  
The input and output pins (I/O0 to I/O15) are placed in a high  
impedance state when the device is deselected (CE HIGH),  
outputs are disabled (OE HIGH), BHE and BLE are disabled  
(BHE, BLE HIGH), or during a write operation (CE LOW and WE  
LOW).  
Automatic power-down when deselected  
TTL compatible inputs and outputs  
Easy memory expansion with CE and OE features  
The CY7C1041DV33 is available in a standard 44-pin 400-mil  
wide SOJ and 44-pin TSOP II package with center power and  
ground (revolutionary) pinout and a 48-ball fine-pitch ball grid  
array (FBGA) package.  
Available in Pb-free 48-ball VFBGA, 44-pin (400-mil) molded  
SOJ, and 44-pin TSOP II Packages  
For best practice recommendations, refer to the Cypress  
application note AN1064, SRAM System Guidelines.  
Logic Block Diagram  
INPUT BUFFER  
A
0
A
1
A
2
IO –IO  
0
7
A
3
4
A
256K × 16  
A
6
IO –IO  
8 15  
5
A
A
7
8
A
COLUMN  
DECODER  
BHE  
WE  
CE  
OE  
BLE  
Note  
1. Automotive product information is preliminary.  
Cypress Semiconductor Corporation  
Document Number: 38-05473 Rev. *I  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 24, 2011  
[+] Feedback  

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