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CY7C1019D-10ZSXI PDF预览

CY7C1019D-10ZSXI

更新时间: 2024-11-14 05:09:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
11页 328K
描述
1-Mbit (128K x 8) Static RAM

CY7C1019D-10ZSXI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2, TSOP32,.46针数:32
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41Factory Lead Time:1 week
风险等级:8.12Is Samacsys:N
最长访问时间:10 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-G32JESD-609代码:e3
长度:20.95 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP32,.46封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.003 A最小待机电流:2 V
子类别:SRAMs最大压摆率:0.08 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:10.16 mm
Base Number Matches:1

CY7C1019D-10ZSXI 数据手册

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CY7C1019D  
1-Mbit (128K x 8) Static RAM  
Features  
Functional Description [1]  
• Pin- and function-compatible with CY7C1019B  
• High speed  
The CY7C1019D is a high-performance CMOS static RAM  
organized as 131,072 words by 8 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and tri-state drivers. This  
device has an automatic power-down feature that significantly  
reduces power consumption when deselected. The eight input  
— tAA = 10 ns  
• Low active power  
— ICC = 80 mA @ 10 ns  
and output pins (IO0 through IO7) are placed in  
high-impedance state when:  
a
• Low CMOS standby power  
— ISB2 = 3 mA  
• Deselected (CE HIGH)  
• 2.0V Data retention  
• Outputs are disabled (OE HIGH)  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
• Center power/ground pinout  
• Easy memory expansion with CE and OE options  
• Functionally equivalent to CY7C1019B  
• When the write operation is active (CE LOW, and WELOW).  
Write to the device by taking Chip Enable (CE) and Write  
Enable (WE) inputs LOW. Data on the eight IO pins (IO0  
through IO7) is then written into the location specified on the  
address pins (A0 through A16).  
Read from the device by taking Chip Enable (CE) and Output  
Enable (OE) LOW while forcing Write Enable (WE) HIGH.  
Under these conditions, the contents of the memory location  
specified by the address pins appears on the IO pins.  
• Available in Pb-free 32-pin 400-Mil wide Molded SOJ and  
32-pin TSOP II packages  
Logic Block Diagram  
IO  
0
INPUT BUFFER  
IO  
1
A
0
IO  
2
A
1
A
2
128K x 8  
IO  
3
A
3
A
4
ARRAY  
IO  
4
A
5
A
6
IO  
5
A
7
A
8
IO  
6
CE  
IO  
POWER  
DOWN  
7
COLUMN DECODER  
WE  
OE  
Note  
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05464 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 22, 2007  
[+] Feedback  

CY7C1019D-10ZSXI 替代型号

型号 品牌 替代类型 描述 数据表
CY7C1019D-10ZSXIT CYPRESS

完全替代

Standard SRAM, 128KX8, 10ns, CMOS, PDSO32,

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