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CY7C1019V33-12VCT PDF预览

CY7C1019V33-12VCT

更新时间: 2024-11-06 21:02:51
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
8页 163K
描述
Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, SOJ-32

CY7C1019V33-12VCT 技术参数

生命周期:Obsolete零件包装代码:SOJ
包装说明:SOJ,针数:32
Reach Compliance Code:unknownECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.68
最长访问时间:12 nsJESD-30 代码:R-PDSO-J32
长度:20.955 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:32
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX8
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:3.7592 mm最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):2.97 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

CY7C1019V33-12VCT 数据手册

 浏览型号CY7C1019V33-12VCT的Datasheet PDF文件第2页浏览型号CY7C1019V33-12VCT的Datasheet PDF文件第3页浏览型号CY7C1019V33-12VCT的Datasheet PDF文件第4页浏览型号CY7C1019V33-12VCT的Datasheet PDF文件第5页浏览型号CY7C1019V33-12VCT的Datasheet PDF文件第6页浏览型号CY7C1019V33-12VCT的Datasheet PDF文件第7页 
019V33  
CY7C1018V33  
CY7C1019V33  
128K x 8 Static RAM  
pins (I/O0 through I/O7) is then written into the location speci-  
fied on the address pins (A0 through A16).  
Features  
• High speed  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
— tAA = 10 ns  
• CMOS for optimum speed/power  
• Center power/ground pinout  
• Automatic power-down when deselected  
• Easy memory expansion with CE and OE options  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE LOW, and WE LOW).  
Functional Description  
The CY7C1018V33/CY7C1019V33 is a high-performance  
CMOS static RAM organized as 131,072 words by 8 bits. Easy  
memory expansion is provided by an active LOW Chip Enable  
(CE), an active LOW Output Enable (OE), and three-state driv-  
ers. This device has an automatic power-down feature that  
significantly reduces power consumption when deselected.  
The CY7C1018V33 is available in a standard 300-mil-wide  
SOJ and CY7C1019V33 is available in  
400-mil-wide package. The CY7C1018V33  
a
standard  
and  
CY7C1019V33 are functionally equivalent in all other re-  
spects.  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O  
Logic Block Diagram  
Pin Configurations  
SOJ  
Top View  
A
0
A
16  
32  
1
A
1
31  
30  
A
15  
2
3
4
5
6
A
2
A
14  
I/O  
0
A
3
A
13  
29  
28  
INPUT BUFFER  
CE  
I/O  
OE  
I/O  
I/O  
I/O  
1
2
27  
26  
0
A
0
7
A
1
I/O  
I/O  
6
7
1
A
2
25  
24  
23  
22  
21  
V
V
8
9
10  
11  
12  
13  
V
CC  
SS  
A
3
4
V
CC  
SS  
A
I/O  
3
I/O  
4
I/O  
5
512 x 256 x 8  
ARRAY  
A
I/O  
I/O  
I/O  
5
6
2
5
A
I/O  
3
4
12  
A
7
8
A
WE  
A
A
4
A
11  
20  
19  
A
5
A
10  
14  
15  
16  
I/O  
6
A
6
A
A
8
POWER  
DOWN  
18  
17  
9
COLUMN  
DECODER  
CE  
A
7
I/O  
7
WE  
1019V332  
1019V331  
OE  
Selection Guide  
7C1018V33-12  
7C1019V33-12  
7C1018V33-15  
7C1019V33-15  
7C1019V33-10  
Maximum Access Time (ns)  
10  
175  
5
12  
160  
5
15  
145  
5
Maximum Operating Current (mA)  
Maximum Standby Current (mA)  
L
0.5  
0.5  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05150 Rev. **  
Revised September 18, 2001  

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