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CY7C1019DV33-10VXI PDF预览

CY7C1019DV33-10VXI

更新时间: 2024-09-15 03:14:23
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
11页 387K
描述
1-Mbit (128K x 8) Static RAM

CY7C1019DV33-10VXI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOJ
包装说明:SOJ, SOJ32,.44针数:32
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:1.33
最长访问时间:10 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-J32JESD-609代码:e4
长度:20.955 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ32,.44封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:3.75 mm
最大待机电流:0.003 A最小待机电流:2 V
子类别:SRAMs最大压摆率:0.06 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:10.16 mm
Base Number Matches:1

CY7C1019DV33-10VXI 数据手册

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CY7C1019DV33  
1-Mbit (128K x 8) Static RAM  
Features  
Functional Description[1]  
• Pin- and function-compatible with CY7C1019CV33  
• High speed  
The CY7C1019DV33 is a high-performance CMOS static  
RAM organized as 131,072 words by 8 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and three-state drivers. This  
device has an automatic power-down feature that significantly  
reduces power consumption when deselected.  
— tAA = 10 ns  
• Low Active Power  
— ICC = 60 mA @ 10 ns  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O  
pins (I/O0 through I/O7) is then written into the location  
specified on the address pins (A0 through A16).  
• Low CMOS Standby Power  
— ISB2 = 3 mA  
• 2.0V Data retention  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
• Center power/ground pinout  
• Easy memory expansion with CE and OE options  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
• Available in Pb-free 32-pin 400-Mil wide Molded SOJ,  
32-pin TSOP II and 48-ball VFBGA packages  
The eight input/output pins (I/O0 through I/O7) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE LOW, and WE LOW).  
The CY7C1019DV33 is available in Pb-free 32-pin 400-Mil  
wide Molded SOJ, 32-pin TSOP II and 48-ball VFBGA  
packages.  
Logic Block Diagram  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
INPUTBUFFER  
A
0
A
1
A
2
A
3
128K × 8  
ARRAY  
A
3
4
5
4
A
5
A
6
A
7
A
8
CE  
WE  
POWER  
DOWN  
6
7
COLUMN  
DECODER  
I/O  
OE  
Note  
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com  
Cypress Semiconductor Corporation  
Document #: 38-05481 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 8, 2006  
[+] Feedback  

CY7C1019DV33-10VXI 替代型号

型号 品牌 替代类型 描述 数据表
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