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BUK464-60H PDF预览

BUK464-60H

更新时间: 2024-11-22 22:50:23
品牌 Logo 应用领域
恩智浦 - NXP 晶体晶体管
页数 文件大小 规格书
7页 57K
描述
PowerMOS transistor

BUK464-60H 数据手册

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Philips Semiconductors  
Product specification  
PowerMOS transistor  
BUK464-60H  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
N-channel enhancement mode  
field-effect power transistor in a  
plastic envelope suitable for surface  
mount applications.  
The device is intended for use in  
automotive and general purpose  
switching applications.  
SYMBOL  
PARAMETER  
MAX.  
UNIT  
VDS  
ID  
Drain-source voltage  
Drain current (DC)  
Total power dissipation  
Junction temperature  
Drain-source on-state  
resistance  
60  
41  
125  
175  
38  
V
A
W
˚C  
m  
Ptot  
Tj  
RDS(ON)  
PINNING - SOT404  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
d
mb  
gate  
2
drain  
g
3
source  
2
mb drain  
1
3
s
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VDS  
VDGR  
±VGS  
ID  
Drain-source voltage  
-
-
60  
60  
V
V
Drain-gate voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (DC)  
RGS = 20 kΩ  
-
-
-
30  
V
Tmb = 25 ˚C  
Tmb = 100 ˚C  
-
41  
29  
164  
125  
175  
175  
A
ID  
-
A
IDM  
Ptot  
Tstg  
Tj  
Drain current (pulse peak value) Tmb = 25 ˚C  
-
A
Total power dissipation  
Storage temperature  
Junction temperature  
Tmb = 25 ˚C  
-
-
-
- 55  
-
W
˚C  
˚C  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP.  
MAX.  
UNIT  
Rth j-mb  
Rth j-a  
Thermal resistance junction to  
-
-
1.2  
K/W  
mounting base  
Thermal resistance junction to  
ambient  
minimum footprint,  
FR4 board (see Fig. 18).  
50  
-
K/W  
February 1996  
1
Rev 1.000  

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