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BS616LV2010EIG70 PDF预览

BS616LV2010EIG70

更新时间: 2024-12-02 03:27:23
品牌 Logo 应用领域
BSI 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 260K
描述
Standard SRAM, 128KX16, 70ns, CMOS, PDSO44

BS616LV2010EIG70 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:TSOP, TSOP44,.46,32Reach Compliance Code:unknown
风险等级:5.84最长访问时间:70 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G44
内存密度:2097152 bit内存集成电路类型:STANDARD SRAM
内存宽度:16湿度敏感等级:3
端子数量:44字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP
封装等效代码:TSOP44,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
电源:3/3.3 V认证状态:Not Qualified
最大待机电流:0.000005 A最小待机电流:1.5 V
子类别:SRAMs最大压摆率:0.03 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
Base Number Matches:1

BS616LV2010EIG70 数据手册

 浏览型号BS616LV2010EIG70的Datasheet PDF文件第2页浏览型号BS616LV2010EIG70的Datasheet PDF文件第3页浏览型号BS616LV2010EIG70的Datasheet PDF文件第4页浏览型号BS616LV2010EIG70的Datasheet PDF文件第5页浏览型号BS616LV2010EIG70的Datasheet PDF文件第6页浏览型号BS616LV2010EIG70的Datasheet PDF文件第7页 
Very Low Power/Voltage CMOS SRAM  
128K X 16 bit  
BSI  
BS616LV2010  
„ FEATURES  
„ DESCRIPTION  
The BS616LV2010 is a high performance, very low power CMOS Static  
Random Access Memory organized as 131,072 words by 16 bits and  
operates from a wide range of 2.7V to 3.6V supply voltage.  
• Very low operation voltage : 2.7 ~ 3.6V  
• Very low power consumption :  
Vcc = 3.0V  
C-grade: 25mA (Max.) operating current  
Advanced CMOS technology and circuit techniques provide both high  
speed and low power features with a typical CMOS standby current  
of 0.15uA and maximum access time of 70ns in 3V operation.  
Easy memory expansion is provided by active LOW chip enable(CE)  
, active LOW output enable(OE) and three-state output drivers.  
The BS616LV2010 has an automatic power down feature, reducing the  
power consumption significantly when chip is deselected.  
I-grade: 30mA (Max.) operating current  
0.15uA (Typ.) CMOS standby current  
• High speed access time :  
-70  
-10  
70ns (Max.) at Vcc = 3.0V  
100ns (Max.) at Vcc = 3.0V  
• Automatic power down when chip is deselected  
• Three state outputs and TTL compatible  
• Fully static operation  
The BS616LV2010 is available in 44L-TSOP2 and 48-ball BGA package.  
• Data retention supply voltage as low as 1.5V  
• Easy expansion with CE and OE options  
• I/O Configuration x8/x16 selectable by LB and UB pin  
„ PRODUCT FAMILY  
POWER DISSIPATION  
SPEED  
STANDBY  
Operating  
PRODUCT  
FAMILY  
OPERATING  
TEMPERATURE  
Vcc  
RANGE  
( ns )  
( ICCSB1 , Max )  
( ICC, Max )  
PKG TYPE  
Vcc=3.0V  
Vcc=3.0V  
Vcc=3.0V  
BS616LV2010EC  
BS616LV2010AC  
BS616LV2010EI  
BS616LV2010AI  
TSOP2-44  
+0O C to +70O C 2.7V ~ 3.6V  
-40O C to +85O C 2.7V ~ 3.6V  
70 / 100  
70 / 100  
8uA  
25mA  
30mA  
BGA-48-0608  
TSOP2-44  
BGA-48-0608  
12uA  
„ BLOCK DIAGRAM  
„ PIN CONFIGURATIONS  
1
2
3
4
5
6
A8  
A13  
A
B
C
D
E
F
LB  
D8  
D9  
OE  
UB  
A0  
A3  
A5  
A1  
A4  
A2  
N.C.  
D0  
A15  
Address  
20  
A16  
A14  
1024  
CE  
D1  
Input  
Row  
Decoder  
Memory Array  
1024 x 2048  
A12  
A7  
D10  
A6  
D2  
Buffer  
A6  
A5  
A4  
VSS D11 N.C.  
A7  
D3  
VCC  
VSS  
VCC  
D14  
D12  
D13  
N.C.  
A14  
A16  
A15  
A13  
A10  
D4  
2048  
Data  
Input  
Buffer  
16  
16  
16  
D5  
D6  
D7  
Column I/O  
DQ0  
.
.
.
.
.
.
.
.
Write Driver  
Sense Amp  
N.C.  
A8  
G
H
D15  
N.C.  
A12  
A9  
WE  
A11  
N.C.  
128  
Data  
Output  
16  
Buffer  
Column Decoder  
DQ15  
48-ball BGA top view  
14  
CE  
WE  
OE  
UB  
1
2
3
4
5
6
7
8
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A4  
A3  
A2  
A1  
A0  
A5  
A6  
A7  
OE  
UB  
LB  
Control  
Address Input Buffer  
CE  
LB  
DQ0  
DQ1  
DQ2  
DQ3  
VCC  
GND  
DQ4  
DQ5  
DQ6  
DQ7  
WE  
A16  
A15  
A14  
A13  
A12  
A11 A9 A3 A2 A1  
A0 A10  
DQ15  
DQ14  
DQ13  
DQ12  
GND  
VCC  
DQ11  
DQ10  
DQ9  
DQ8  
NC  
A8  
A9  
A10  
A11  
NC  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
Vcc  
BS616LV2010EC  
BS616LV2010EI  
Gnd  
Brilliance Semiconductor, Inc. reserves the right to modify document contents without notice.  
Revision 2.3  
R0201-BS616LV2010  
1
Jan.  
2004  

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