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BS616LV2013AC PDF预览

BS616LV2013AC

更新时间: 2024-02-13 22:36:02
品牌 Logo 应用领域
BSI 静态存储器
页数 文件大小 规格书
11页 242K
描述
Very Low Power/Voltage CMOS SRAM 128K X 16 bit

BS616LV2013AC 数据手册

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Very Low Power/Voltage CMOS SRAM  
128K X 16 bit  
BSI  
BS616LV2013  
„ FEATURES  
„ DESCRIPTION  
• Very low operation voltage : 2.4 ~ 3.6V  
• Very low power consumption :  
The BS616LV2013 is a high performance, very low power CMOS Static  
Random Access Memory organized as 131,072 words by 16 bits and  
operates from a wide range of 2.4V to 3.6V supply voltage.  
Advanced CMOS technology and circuit techniques provide both high  
speed and low power features with a typical CMOS standby current  
of 0.1uA and maximum access time of 70/100ns in 3V operation.  
Easy memory expansion is provided by active LOW chip  
enable(CE), active LOW output enable(OE) and three-state output  
drivers.  
Vcc = 3.0V  
C-grade: 20mA (Max.) operating current  
I -grade: 25mA (Max.) operating current  
0.1uA (Typ.) CMOS standby current  
• High speed access time :  
-70  
-10  
70ns (Max.) at Vcc = 3.0V  
100ns (Max.) at Vcc = 3.0V  
• Automatic power down when chip is deselected  
• Three state outputs and TTL compatible  
• Fully static operation  
The BS616LV2013 has an automatic power down feature, reducing the  
power consumption significantly when chip is deselected.  
The BS616LV2013 is available in DICE form, JEDEC standard 44-pin  
TSOP Type II package , JEDEC standard 48-pin TSOP Type I package  
and 48-ball BGA package.  
• Data retention supply voltage as low as 1.5V  
• Easy expansion with CE and OE options  
• I/O Configuration x8/x16 selectable by LB and UB pin  
„ PRODUCT FAMILY  
POWER DISSIPATION  
SPEED  
( ns )  
(SICTCASBN1,DMBaxY)  
Operating  
PRODUCT  
FAMILY  
OPERATING  
Vcc  
( ICC, Max )  
PKG TYPE  
TEMPERATURE  
RANGE  
Vcc=3.0V  
Vcc=3.0V  
Vcc=3.0V  
BS616LV2013DC  
BS616LV2013EC  
BS616LV2013TC  
BS616LV2013AC  
BS616LV2013DI  
BS616LV2013EI  
BS616LV2013TI  
BS616LV2013AI  
DICE  
TSOP2-44  
TSOP1-48  
BGA-48-0608  
DICE  
+0 O C to +70O  
-40 O C to +85O  
C
C
2.4V ~3.6V  
2.4V ~ 3.6V  
70/100  
0.7uA  
1.5uA  
20mA  
TSOP2-44  
TSOP1-48  
BGA-48-0608  
70/100  
25mA  
„ PIN CONFIGURATIONS  
„ BLOCK DIAGRAM  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A4  
A5  
2
A3  
A6  
3
A2  
A7  
4
A1  
A8  
A13  
OE  
5
A0  
UB  
6
CE  
LB  
7
A15  
A16  
A14  
DQ0  
DQ15  
DQ14  
DQ13  
DQ12  
GND  
VCC  
DQ11  
DQ10  
DQ9  
DQ8  
NC  
Address  
8
DQ1  
20  
1024  
9
DQ2  
Input  
10  
DQ3  
Row  
BS616LV2013EC  
Memory Array  
1024 x 2048  
11  
VCC  
A12  
A7  
12  
BS616LV2013EI  
GND  
Buffer  
13  
DQ4  
Decoder  
14  
DQ5  
A6  
A5  
A4  
15  
DQ6  
16  
DQ7  
17  
WE  
18  
A16  
A8  
A9  
A10  
A11  
NC  
2048  
19  
A15  
Data  
20  
A14  
16  
16  
16  
21  
Column I/O  
Input  
A13  
DQ0  
22  
A12  
Buffer  
.
.
.
.
.
.
.
.
Write Driver  
Sense Amp  
1
2
3
4
5
6
128  
Data  
16  
Output  
A
B
C
D
E
F
LB  
D8  
D9  
OE  
UB  
A0  
A3  
A1  
A4  
A2  
N.C.  
D0  
Buffer  
Column Decoder  
DQ15  
CE  
D1  
14  
CE  
WE  
OE  
UB  
D10  
D11  
D12  
D13  
A5  
A6  
D2  
Control  
Address Input Buffer  
VSS  
VCC  
N.C.  
N.C.  
A14  
A12  
A9  
A7  
D3  
VCC  
VSS  
LB  
A11 A9 A3 A2 A1  
A0 A10  
A16  
A15  
A13  
A10  
D4  
Vcc  
Gnd  
D14  
D15  
N.C.  
D5  
D6  
G
H
WE  
A11  
D7  
N.C.  
A8  
N.C.  
Brillia4n8-cbaell BSGeAmtopivcieow nductor Inc. reserves the right to modify document contents without notice.  
Revision 2.5  
April 2002  
R0201-BS616LV2013  
1

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