Very Low Power CMOS SRAM
128K X 16 bit
BS616LV2016
Pb-Free and Green package materials are compliant to RoHS
FEATURES
DESCRIPTION
y Wide VCC operation voltage : 2.4V ~ 5.5V
y Very low power consumption :
The BS616LV2016 is a high performance, very low power CMOS
Static Random Access Memory organized as 131,072 by 16 bits and
operates form a wide range of 2.4V to 5.5V supply voltage.
Advanced CMOS technology and circuit techniques provide both
high speed and low power features with maximum CMOS standby
current of 2/20uA at Vcc=3V/5V at 85OC and maximum access time
of 55/70ns.
VCC = 3.0V
Operation current : 30mA (Max.) at 55ns
2mA (Max.) at 1MHz
Standby current : 0.7/2uA (Max.) at 70/85OC
Operation current : 62mA (Max.) at 55ns
8mA (Max.) at 1MHz
VCC = 5.0V
Standby current : 6/20uA (Max.)at 70/85OC
y High speed access time :
Easy memory expansion is provided by an active LOW chip enable
(CE) and active LOW output enable (OE) and three-state output
drivers.
The BS616LV2016 has an automatic power down feature, reducing
the power consumption significantly when chip is deselected.
The BS616LV2016 is available in DICE form, JEDEC standard
44-pin TSOP II package and 48-ball BGA package.
-55
-70
55ns(Max.) at VCC=3.0~5.5V
70ns(Max.) at VCC=2.7~5.5V
y Automatic power down when chip is deselected
y Easy expansion with CE and OE options
y I/O Configuration x8/x16 selectable by LB and UB pin.
y Three state outputs and TTL compatible
y Fully static operation
y Data retention supply voltage as low as 1.5V
POWER CONSUMPTION
POWER DISSIPATION
Operating
STANDBY
PRODUCT
FAMILY
OPERATING
PKG TYPE
(ICCSB1, Max)
(ICC, Max)
TEMPERATURE
VCC=5.0V
10MHz
VCC=3.0V
10MHz
VCC=5.0V VCC=3.0V
1MHz
7mA
fMax.
1MHz
fMax.
BS616LV2016DC
BS616LV2016EC
BS616LV2016AI
BS616LV2016EI
DICE
Commercial
6.0uA
20uA
0.7uA
2.0uA
39mA
40mA
60mA
1.5mA
14mA
15mA
29mA
+0OC to +70OC
TSOP II-44
BGA-48-0608
TSOP II-44
Industrial
8mA
62mA
2mA
30mA
-40OC to +85OC
PIN CONFIGURATIONS
BLOCK DIAGRAM
A4
1
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A3
2
A6
A2
3
A7
A1
4
OE
A11
A10
A9
A0
5
UB
CE
6
LB
DQ0
DQ1
DQ2
DQ3
VCC
VSS
DQ4
DQ5
DQ6
DQ7
WE
A16
A15
A14
A13
A12
7
DQ15
DQ14
DQ13
DQ12
VSS
VCC
DQ11
DQ10
DQ9
DQ8
NC
8
A8
A7
A6
A5
A4
A3
A2
Address
Input
1024
Memory Array
10
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Row
Decoder
BS616LV2016EC
BS616LV2016EI
Buffer
1024 x 2048
2048
A8
A9
DQ0
.
.
.
.
.
.
Data
16
Column I/O
A10
A11
NC
16
Input
.
.
.
.
.
.
Buffer
Write Driver
Sense Amp
16
1
2
3
4
5
6
16
Data
Output
Buffer
128
NC
A
B
C
D
E
F
LB
OE
A0
A1
A2
Column Decoder
DQ15
D8
D9
UB
D10
D11
D12
D13
NC
A3
A5
A4
A6
CE
D1
D0
D2
7
CE
WE
OE
UB
LB
Address Input Buffer
Control
VSS
VCC
D14
D15
NC
NC
NC
A14
A12
A9
A7
D3
VCC
VSS
D6
A12 A13 A14 A15 A16
A1
A0
A16
A15
A13
A10
D4
VCC
VSS
D5
G
H
WE
A11
D7
A8
NC
48-ball BGA top view
Brilliance Semiconductor, Inc. reserves the right to change products and specifications without notice.
R0201-BS66LV2016
Revision
1.5
1
Oct.
2008