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AUIRLR014NTR PDF预览

AUIRLR014NTR

更新时间: 2024-01-05 15:51:48
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 203K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

AUIRLR014NTR 数据手册

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AUTOMOTIVEGRADE  
PD - 97740  
AUIRLR014N  
HEXFET® Power MOSFET  
• AdvancedPlanarTechnology  
• Logic-LevelGateDrive  
• LowOn-Resistance  
• Dynamic dV/dT Rating  
• 175°COperatingTemperature  
• Fast Switching  
D
S
V(BR)DSS  
RDS(on) max.  
ID  
55V  
0.14  
G
• Fully Avalanche Rated  
• Repetitive Avalanche Allowed up to Tjmax  
• Lead-Free,RoHSCompliant  
• AutomotiveQualified*  
10A  
D
Description  
Specifically designed for Automotive applications,  
this cellular design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve  
low on-resistance per silicon area. This benefit com-  
bined with the fast switching speed and ruggedized  
device design that HEXFET power MOSFETs are  
well known for, provides the designer with an ex-  
tremely efficient and reliable device for use in Auto-  
motive and a wide variety of other applications.  
S
G
D-Pak  
AUIRLR014N  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
10  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V  
@ T = 25°C  
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
7.1  
40  
A
@ T = 100°C  
C
DM  
28  
Power Dissipation  
@T = 25°C  
C
W
W/°C  
V
P
D
0.2  
Linear Derating Factor  
Gate-to-Source Voltage  
± 16  
V
GS  
EAS  
IAR  
35  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
6.0  
EAR  
dv/dt  
2.8  
5.0  
Repetitive Avalanche Energy  
Peak Diode Recovery  
mJ  
V/ns  
-55 to + 175  
Operating Junction and  
T
T
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
Max.  
5.3  
Units  
RJC  
RJA  
RJA  
Junction-to-Case  
–––  
–––  
–––  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
50  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
11/10/11  

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