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AUIRFS8407-7P PDF预览

AUIRFS8407-7P

更新时间: 2024-01-25 21:37:29
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 220K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

AUIRFS8407-7P 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:,Reach Compliance Code:unknown
风险等级:5.67配置:Single
最大漏极电流 (Abs) (ID):240 AFET 技术:METAL-OXIDE SEMICONDUCTOR
最高工作温度:175 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):231 W子类别:FET General Purpose Power
表面贴装:YESBase Number Matches:1

AUIRFS8407-7P 数据手册

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AUTOMOTIVE GRADE  
AUIRFS8407-7P  
Features  
HEXFET® Power MOSFET  
AdvancedProcessTechnology  
D
S
NewUltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
RepetitiveAvalancheAlloweduptoTjmax  
Lead-Free,RoHSCompliant  
AutomotiveQualified*  
VDSS  
40V  
R
DS(on)
typ.  
max.  
1.0mΩ  
1.3mΩ  
G
ID  
306A  
(Silicon Limited)  
Description  
ID  
240A  
(Package Limited)  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniquestoachieveextremelylowon-resistancepersilicon  
area. Additional features of this design are a 175°C junction  
operating temperature, fast switching speed and improved  
repetitive avalanche rating. These features combine to make  
thisdesignanextremelyefficientandreliabledeviceforusein  
Automotiveapplicationsandwidevarietyofotherapplications.  
D
S
S
S
S
S
Applications  
G
D2Pak7Pin  
Electric Power Steering (EPS)  
Battery Switch  
Start/Stop Micro Hybrid  
HeavyLoads  
G
Gate  
D
S
Drain  
Source  
DC-DCApplications  
Base part number  
Package Type  
Standard Pack  
Orderable Part Number  
Form  
Tube  
Tape and Reel Left  
Tape and Reel Right  
Quantity  
50  
AUIRFS8407-7P  
AUIRFS8407-7TRL  
AUIRFS8407-7TRR  
AUIRFS8407-7P  
D2Pak-7PIN  
800  
800  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and  
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-  
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Max.  
306  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
216  
A
240  
1040  
Pulsed Drain Current  
231  
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
W
1.5  
W/°C  
V
± 20  
VGS  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
EAS (Thermally limited)  
344  
508  
mJ  
EAS (tested)  
IAR  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
  
See Fig. 14, 15, 24a, 24b  
A
Repetitive Avalanche Energy   
Operating Junction and  
EAR  
mJ  
-55 to + 175  
300  
TJ  
°C  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com © 2013 International Rectifier  
April 30, 2013  
1

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型号 品牌 替代类型 描述 数据表
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