PD - 96320
AUTOMOTIVE GRADE
AUIRFR2905Z
HEXFET® Power MOSFET
V(BR)DSS
55V
11.1m
14.5m
59A
Features
D
l
l
l
l
l
l
l
AdvancedProcessTechnology
RDS(on) typ.
max.
Ω
Ω
UltraLowOn-Resistance
175°COperatingTemperature
FastSwitching
G
ID (Silicon Limited)
ID (Package Limited)
D
RepetitiveAvalancheAlloweduptoTjmax
Lead-Free,RoHSCompliant
AutomotiveQualified*
S
42A
Description
SpecificallydesignedforAutomotiveapplications,thisHEXFET®
Power MOSFET utilizes the latest processing techniques to
achieveextremelylowon-resistancepersiliconarea. Additional
features of this design are a 175°C junction operating
temperature, fast switching speed and improved repetitive
avalancherating.Thesefeaturescombinetomakethisdesign
anextremelyefficientandreliabledeviceforuseinAutomotive
applicationsandawidevarietyofotherapplications.
S
D
G
D-Pak
AUIRFR2905Z
G
D
S
AbsoluteMaximumRatings
Gate
Drain
Source
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice. Theseare
stress ratings only; andfunctionaloperationofthedeviceattheseoranyotherconditionbeyondthoseindicatedinthe
specificationsisnotimplied.Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. Thethermalresistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
Parameter
Units
(Silicon Limited)
Continuous Drain Current, VGS @ 10V
@ T = 25°C
C
59
I
I
I
I
D
D
D
Continuous Drain Current, VGS @ 10V (Silicon Limited)
42
A
@ T = 100°C
C
(Package Limited)
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
42
@ T = 25°C
C
240
DM
110
P
@T = 25°C Power Dissipation
W
W/°C
V
D
C
0.72
Linear Derating Factor
Gate-to-Source Voltage
± 20
V
GS
EAS
AS (Tested )
55
Single Pulse Avalanche Energy(Thermally limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
mJ
E
82
IAR
See Fig.12a, 12b, 15, 16
A
EAR
Repetitive Avalanche Energy
mJ
-55 to + 175
T
T
Operating Junction and
J
Storage Temperature Range
°C
STG
300 (1.6mm from case )
10 lbf in (1.1N m)
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
1.38
50
Units
RθJC
RθJA
RθJA
Junction-to-Case
Junction-to-Ambient (PCB mount)
°C/W
Junction-to-Ambient
110
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
07/20/10