PD - 97644
AUTOMOTIVE GRADE
AUIRFR3806
HEXFET® Power MOSFET
Features
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Advanced Process Technology
D
VDSS
RDS(on) typ.
max.
60V
Ultra Low On-Resistance
Dynamic dV/dT Rating
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
12.6m
15.8m
43A
Ω
Ω
G
ID
S
D
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to achieve
extremely low on-resistance per silicon area. Additional features of
thisdesign area175°Cjunctionoperatingtemperature,fastswitching
speed and improved repetitive avalanche rating . These features
combine to make this design an extremely efficient and reliable
device for use in Automotive applications and a wide variety of other
S
G
D-Pak
AUIRFR3806
G
D
S
applications.
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Symbol
ID @ TC = 25°C
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Max.
43
Units
A
ID @ TC = 100°C
IDM
31
170
PD @TC = 25°C
W
71
Maximum Power Dissipation
Linear Derating Factor
0.47
W/°C
V
VGS
EAS
IAR
± 20
Gate-to-Source Voltage
73
mJ
A
Single Pulse Avalanche Energy (Thermally Limited)
Avalanche Current
25
7.1
Repetitive Avalanche Energy
EAR
mJ
24
Peak Diode Recovery
dv/dt
TJ
V/ns
°C
-55 to + 175
Operating Junction and
TSTG
Storage Temperature Range
300
Soldering Temperature, for 10 seconds (1.6mm from case)
Thermal Resistance
Symbol
Parameter
Typ.
–––
Max.
2.12
–––
62
Units
Rθ
Junction-to-Case
JC
Rθ
0.50
–––
°C/W
Case-to-Sink, Flat Greased Surface
Junction-to-Ambient
CS
RθJA
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
03/11/11