2SK3693-01MR
200305
FUJI POWER MOSFET
N-CHANNEL SILICON POWER MOSFET
Super FAP-G Series
Outline Drawings [mm]
Features
TO-220F
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DCconverters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Drain-source voltage
Symbol
VDS
Ratings
Unit
V
450
450
±17
±68
±30
17
VDSX *5
ID
V
A
Equivalent circuit schematic
Continuous drain current
Pulsed drain current
ID(puls]
VGS
IAR
A
Gate-source voltage
V
Drain(D)
Repetitive or non-repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
*2
*1
A
EAS
221.9
20
mJ
dVDS/dt *4
dV/dt
kV/µs
*3
5
kV/µs
W
Gate(G)
°C
°C
PD Ta=25
Tc=25
Tch
2.16
80
Source(S)
Operating and storage
temperature range
Isolation Voltage
+150
-55 to +150
2000
°C
°C
V
Tstg
Viso *6
<
*1 L=1.41mH, Vcc=45V, Tch=25°C See to Avalanche Energy Graph *2 Tch 150°C
=
<
<
<
<
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C
*4 VDS 450V *5 VGS=-30V
*6 f=6-Hz, t=60sec.
=
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Symbol
V(BR)DSS
VGS(th)
Item
Test Conditions
Drain-source breakdown voltaget
Gate threshold voltage
µ
450
3.0
V
ID= 250 A
VGS=0V
µ
5.0
25
V
ID= 250 A
VDS=VGS
µA
VDS=450V VGS=0V
Tch=25°C
Zero gate voltage drain current
IDSS
250
100
Tch=125°C
VDS=360V VGS=0V
VGS=±30V
VDS=0V
ID=8.5A VGS=10V
ID=8.5A VDS=25V
VDS=25V
IGSS
RDS(on)
gfs
nA
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
0.29
0.38
Ω
7
14
1275
200
S
Ciss
1900
300
14
pF
Coss
Crss
td(on)
tr
Output capacitance
VGS=0V
9.5
Reverse transfer capacitance
Turn-on time ton
f=1MHz
VCC=300V ID=8.5A
ns
27
40
27
40
VGS=10V
48
72
td(off)
tf
Turn-off time toff
RGS=10 Ω
7
11
33
50
QG
nC
Total Gate Charge
VCC=225V
ID=17A
13.5
10.5
20.3
16
QGS
QGD
IAV
Gate-Source Charge
Gate-Drain Charge
VGS=10V
17
A
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
L=1.41mH Tch=25°C
1.20
1.80
VSD
trr
Qrr
V
IF=17A VGS=0V Tch=25°C
IF=17A VGS=0V
-di/dt=100A/µs
0.57
6.5
µs
µC
Tch=25°C
Thermalcharacteristics
Item
Min.
Typ.
Max. Units
Symbol
Test Conditions
Rth(ch-c)
channel to case
1.563
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
58.0
°C/W
1