2SK3700
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSⅣ)
2SK3700
Switching Regulator Applications
Unit: mm
•
•
•
•
Low drain-source ON-resistance: R
= 2.0 Ω (typ.)
DS (ON)
High forward transfer admittance: |Y | = 4.5 S (typ.)
fs
Low leakage current: I
= 100 μA (max) (V
= 720 V)
DS
DSS
Enhancement model: V = 2.0 to 4.0 V (V
= 10 V, I = 1 mA)
D
th
DS
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Drain-source voltage
Symbol
Rating
Unit
V
900
900
±30
5
V
V
V
DSS
Drain-gate voltage (R
Gate-source voltage
= 20 kΩ)
V
GS
DGR
V
GSS
DC (Note 1)
Pulse (Note 1)
I
D
Drain current
A
1. GATE
I
15
DP
2. DRAIN (HEAT SINK)
3. SOURCE
Drain power dissipation (Tc=25°C)
Single pulse avalanche energy
P
150
W
D
E
I
351
mJ
AS
JEDEC
JEITA
―
―
(Note 2)
Avalanche current
5
15
A
AR
Repetitive avalanche energy (Note 3)
Channel temperature
E
mJ
°C
°C
AR
TOSHIBA
2-16C1B
T
150
ch
Weight: 4.6 g (typ.)
Storage temperature range
T
stg
−55 to150
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Symbol
Max
Unit
Thermal resistance, channel to case
Thermal resistance, channel to ambient
R
0.833
50
°C/W
°C/W
th (ch-c)
R
th (ch-a)
Note 1: Ensure that the temperature does not exceed 150℃.
Note 2: = 90 V, T = 25°C (initial), L = 25.7mH, R = 25 Ω, I = 5 A
AR
V
DD
ch
G
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device. Please handle with caution.
1
2009-09-29