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UPDS1040L

更新时间： 2024-11-20 19:47:55
品牌 Logo 应用领域
美高森美 - MICROSEMI 功效瞄准线光电二极管
页数 文件大小 规格书
4页 396K
描述
Rectifier Diode, Schottky, 1 Phase, 1 Element, 10A, 40V V(RRM), Silicon, PLASTIC, POWERDI 5, 3 PIN

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UPDS1040L 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：R-PDSO-F3针数：3
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8541.10.00.80风险等级：5.84
其他特性：FREE WHEELING DIODE, LOW POWER LOSS应用：EFFICIENCY
外壳连接：CATHODE配置：SINGLE
二极管元件材料：SILICON二极管类型：RECTIFIER DIODE
最大正向电压 (VF)：0.46 VJESD-30 代码：R-PDSO-F3
JESD-609代码：e0湿度敏感等级：1
最大非重复峰值正向电流：275 A元件数量：1
相数：1端子数量：3
最高工作温度：150 °C最低工作温度：-65 °C
最大输出电流：10 A封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
最大重复峰值反向电压：40 V子类别：Rectifier Diodes
表面贴装：YES技术：SCHOTTKY
端子面层：TIN LEAD端子形式：FLAT
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

UPDS1040L 数据手册

 浏览型号UPDS1040L的Datasheet PDF文件第2页浏览型号UPDS1040L的Datasheet PDF文件第3页浏览型号UPDS1040L的Datasheet PDF文件第4页 
UPDS1040L  
10 Amp Low VF Schottky Barrier Rectifier  
PowerDI™ 5  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The UPDS1040L offers a small and powerful surface mount package for a  
40 Volt 10 Amp rated Schottky with very low forward voltage and leakage  
current. For critical applications requiring very fast switching, these  
Schottky higher reverse voltage ratings with their “hot carrier” features  
provide extremely fast switching to replace conventional ultrafast rectifiers.  
The very low thermal resistance of the PowerDI™5 package design permits  
cooler operating junction temperatures for minimal reverse leakage  
currents and lower power loss.  
PowerDI™5  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
•
•
•
•
•
•
•
•
•
Guard ring die construction for transient protection  
Low power loss, high efficiency  
•
•
Silicon Schottky (hot carrier) rectifier for minimal  
t and elimination of reverse-recovery oscillations  
rr  
to reduce need for EMI filtering  
Low forward voltage drop  
For use in high-frequency switching power  
supplies, inverters, free wheeling, polarity  
protection, and “O-Ring” applications  
Low reverse leakage current  
High junction temperature capability  
High forward surge current capability  
Environmentally friendly molding compound (no Br, Sb)  
Low inductive parasitics for minimal Ldi/dt effects  
•
•
Low power loss and high efficiency  
Robust package configuration for pick-and-place  
handling  
Lead-Free Finish & RoHS Compliant per EU Directive Rev  
13.2.2003 (glass and high temperature solder exemptions  
per Annex Notes 5 and 7 therein)  
•
Full-metallic bottom eliminates flux entrapment  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
•
Junction and Storage Temperature (TJ, TSTG): -65 to  
+150oC  
•
Case Material: Molded Plastic, Environmentally  
Friendly “Green” Molding Compound. UL  
Flammability Classification Rating 94V-0  
•
•
Average Rectified Output Current (IO): 10 Amps for Single  
phase, half wave, 60Hz, resistive or inductive load (also  
see Figure 5). For capacitive load, derate current by 20%.  
•
•
Moisture sensitivity: Level 1 per J-STD-020C.  
Terminals: Finish – Matte Tin annealed over  
Copper lead frame (  
per JESD97)  
Peak Repetitive Reverse Voltage (VRRM): 40 V Working  
Peak Reverse Voltage (VRWM): 40 V  
Solderable per MIL-STD-202, Method 208  
•
•
Marking: See marking information on page 3  
DC Blocking Voltage (VR): 40 V  
Polarity: See diagram in “Dimensions &  
Schematic” (page 4)  
•
•
RMS Reverse Voltage (VR(RMS): 28 V  
Non-Repetitive Peak Forward Surge Current @ 8.3 ms  
Single half sine-wave Superimposed on Rated Load  
(IFSM): 275A  
•
•
Weight: 0.096 grams (approx.)  
Tape & Reel Option: 5000/reel (13”)  
•
•
Thermal Resistance Junction to case bottom (RθJC) or  
Soldering Point (RθJS): 1.5oC/W  
Thermal Resistance (RθJA): 95oC/W (Note 1), 65oC/W  
(Note 2), 50oC/W (Note 3) junction to ambient air (see last  
page)  
Notes: 1. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout (pg 4)  
2. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout (pg 4)  
3. Polyimide PCB, 2 oz. Copper with larger Cathode pad dimensions  
9.4 mm x 7.2 mm and Anode pad dimensions 2.7 mm x 1.6 mm  
Microsemi  
Page 1  
Copyright © 2005  
7-01-2005 REV 0  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1234

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