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UPF1N50E3 PDF预览

UPF1N50E3

更新时间: 2024-11-18 20:56:03
品牌 Logo 应用领域
美高森美 - MICROSEMI 开关晶体管
页数 文件大小 规格书
3页 65K
描述
Power Field-Effect Transistor, 1A I(D), 500V, 3.5ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLASTIC, POWERMITE-3

UPF1N50E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.38
其他特性:LOW LEAKAGE CURRENT外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (ID):1 A最大漏源导通电阻:3.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:125 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子面层:PURE TIN端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

UPF1N50E3 数据手册

 浏览型号UPF1N50E3的Datasheet PDF文件第2页浏览型号UPF1N50E3的Datasheet PDF文件第3页 
UPF1N50  
SURFACE MOUNT N CHANNEL MOSFET  
W AT E R T OW N D I V I S I O N  
PRELIMINARY  
DESCRIPTION  
KEY FEATURES  
!"POWERMITE 3 Surface Mount  
Package  
Power MOS V(R) MOSFET in ultra low profile patented Powermite 3(TM)  
package provides the designer with the best combination of fast Switching,  
ruggedized device design, low on-resistance, cost effectiveness in the  
industry's smallest high power surface mount package.  
!"Low On-State Resistance  
!"High Frequency Switching  
!"Ultra Low Leakage current  
!"Integral Heat Sink / Locking  
Tabs  
The UPF1N50 is ideal for ultra small motor control and switch mode power  
supply applications.  
!"Supplied in 16mm Tape and  
Reel – 6000 units/reel  
!"Superior Low Thermal And  
Electrical capability  
The Powermite 3 is designed for surface mounting using vapor phase,  
infrared, or wave soldering techniques. With power dissipation levels up to  
1.8 Watts, the Powermite 3 offers similar power handling capability to device  
4 times its size by using a patented full metal wrap around bottom.  
APPLICATIONS/BENEFITS  
Motor Control  
Switch Mode Power Supplies  
IMPORTANT:  
For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
MECHANICAL CHARACTERISTICS  
POWERMITE 3 Surface Mount Package  
2
Footprint Area of 16.51 mm  
Case: Molded Epoxy  
Meets UL94VO at 1/8 inch  
Weight: 72 milligrams  
Lead and Mounting Temperatures: 260 0C max for 10 seconds  
MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
VALUE  
UNIT  
Drain-to-Source Voltage  
V
500  
+/-20  
1.0  
Volts  
Volts  
Amps  
Amps  
DSS  
Drain-to-Source Voltage  
V
GS  
Continuous Drain Current @ TC = 25ºC  
Continuous Drain Current @ TC = 100ºC  
I
D1  
I
0.8  
D2  
Operating & Storage Junction Temperature Range  
Total Power Dissipation  
T
T
- 40 to + 125  
ºC  
Watts  
J, STG  
PD (1)  
1.8  
THERMAL CHARACTERISTICS  
STEADY STATE  
-
THERMAL RESISTANCE  
:
SYMBOL  
VALUE  
UNIT  
Junction-to-Tab  
(1) Junction-to-ambient  
(2) Junction-to-ambient  
RθJ-TAB  
RθJA (1)  
RθJA (2)  
2.0  
55  
120  
°C/Watts  
°C/Watts  
°C/Watts  
(1) Mounted on 2” square by 0.06’ thick FR4 board with a 1× 1square 2-ounce cooper pattern.  
(2) Mounted on 0.06’ thick FR4 board, using recommended footprint.  
Copyright 2000  
MSC1541.PDF 2000-08-08  
Microsemi  
Page 1  
Watertown Division  
580 Pleasant Street, Watertown, MA. 02172, 617-926-0404, Fax: 617-924-1235  

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