SSD50N08-14D
55A, 80V, RDS(ON) 11mΩ
N-Ch Enhancement Mode Power MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen free
TO-252(D-Pack)
DESCRIPTION
These miniature surface mount MOSFETs utilize a high
cell density trench process to provide low RDS(on) and to
ensure minimal power loss and heat dissipation.
FEATURES
ꢀ
Low RDS(on) provides higher efficiency and extends
battery life
A
B
C
D
ꢀ
Low thermal impedance copper leadframe TO-252
saves board space
ꢀ
ꢀ
Fast switching speed
High performance trench technology
G E
K
J
H F
APPLICATION
N
O
P
DC-DC converters and power management in portable
M
and battery-powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
Millimeter
Millimeter
REF.
REF.
Min.
Max.
Min.
Max.
A
B
C
D
E
F
6.4
5.20
2.20
0.45
6.8
2.40
5.40
0.8
6.8
5.50
2.40
0.58
7.3
3.0
6.2
1.20
J
K
M
N
O
P
2.30 REF.
0.70
0.50
0.9
0.90
1.1
1.6
PACKAGE INFORMATION
0
0.43
0.15
0.58
Package
MPQ
Leader Size
G
H
TO-252
2.5K
13’ inch
2
Drain
1
Gate
3
Source
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
80
V
V
A
A
A
VGS
±20
Continuous Drain Current 1
Pulsed Drain Current 2
TA=25℃
ID
55
IDM
200
Continuous Source Current (Diode Conduction) 1
IS
55
Power Dissipation 1
TA=25℃
PD
50
W
°C
Operating Junction and Storage Temperature Range
TJ, TSTG
-55 ~ 175
Thermal Resistance Ratings
Maximum Thermal Resistance Junction-Ambient 1
RθJA
RθJC
40
°C / W
°C / W
Maximum Thermal Resistance Junction-Case
3.0
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
21-Jan-2014 Rev. A
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