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SSD50P03-09D PDF预览

SSD50P03-09D

更新时间: 2024-09-25 09:05:03
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SECOS /
页数 文件大小 规格书
2页 146K
描述
P-Ch Enhancement Mode Power MOSFET

SSD50P03-09D 数据手册

 浏览型号SSD50P03-09D的Datasheet PDF文件第2页 
SSD50P03-09D  
61A, -30V, RDS(ON) 9mΩ  
P-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen free  
TO-252(D-Pack)  
DESCRIPTION  
These miniature surface mount MOSFETs utilize high  
cell density process. Low RDS(on) assures minimal power  
loss and conserves energy, making this device ideal for  
use in power management circuitry. Typical applications  
are PWMDC-DC converters, power management in  
portable and battery-powered products such as computers,  
printers, battery charger, telecommunication power system,  
and telephones power system.  
A
B
C
D
FEATURES  
G E  
Low RDS(on) provides higher efficiency and extends  
battery life.  
K
J
H F  
N
O
P
Miniature TO-252 surface mount package saves board  
space.  
M
High power and current handling capability.  
Extended VGS range (±25) for battery pack applications.  
Millimeter  
Min. Max.  
Millimeter  
REF.  
REF.  
Min.  
Max.  
A
B
C
D
E
F
6.4  
5.20  
2.20  
0.45  
6.8  
2.40  
5.40  
0.8  
6.8  
5.50  
2.40  
0.58  
7.3  
3.0  
6.2  
1.20  
J
K
M
N
O
P
2.30 REF.  
0.70  
0.50  
0.9  
0.90  
1.1  
1.6  
PACKAGE INFORMATION  
0
0.43  
0.15  
0.58  
Package  
MPQ  
LeaderSize  
G
H
TO-252  
2.5K  
13’ inch  
  
Drain  
  
Gate  
  
Source  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)  
PARAMETER  
SYMBOL  
VDS  
RATINGS  
UNIT  
Drain-Source Voltage  
-30  
±25  
V
V
Gate-Source Voltage  
VGS  
Continuous Drain Current 1  
Pulsed Drain Current 2  
ID @TA=25℃  
IDM  
61  
A
±40  
A
Continuous Source Current (Diode Conduction) 1  
Total Power Dissipation 1  
IS  
-30  
A
PD @TA=25℃  
TJ, TSTG  
50  
W
°C  
Operating Junction and Storage Temperature Range  
-55 ~ 175  
THERMAL RESISTANCE RATINGS  
Maximum Thermal Resistance Junction-Ambient 1  
RθJA  
RθJC  
50  
°C / W  
°C / W  
Maximum Thermal Resistance Junction-Case  
3.0  
Notes  
1
2
Surface Mounted on 1” x 1” FR4 Board.  
Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
02-Dec-2010 Rev.A  
Page 1 of 2  

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