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SN54LVTH240_16 PDF预览

SN54LVTH240_16

更新时间: 2024-09-16 02:58:27
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德州仪器 - TI 驱动输出元件
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描述
3.3-V ABT OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

SN54LVTH240_16 数据手册

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SN54LVTH240, SN74LVTH240A  
3.3-V ABT OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS679F – DECEMBER 1996 – REVISED MARCH 2000  
SN54LVTH240 . . . J PACKAGE  
SN74LVTH240A . . . DB, DW, OR PW PACKAGE  
(TOP VIEW)  
State-of-the-Art Advanced BiCMOS  
Technology (ABT) Design for 3.3-V  
Operation and Low Static-Power  
Dissipation  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
Support Mixed-Mode Signal Operation (5-V  
Input and Output Voltages With 3.3-V V  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
)
CC  
Support Unregulated Battery Operation  
Down to 2.7 V  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
OLP  
CC  
= 3.3 V, T = 25°C  
A
13 2A2  
12 1Y4  
I
and Power-Up 3-State Support Hot  
off  
Insertion  
11  
2A1  
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
SN54LVTH240 . . . FK PACKAGE  
(TOP VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
3
2
1 20 19  
18  
4
5
6
7
8
1Y1  
2A4  
1Y2  
2A3  
1Y3  
1A2  
2Y3  
1A3  
2Y2  
1A4  
17  
16  
15  
14  
– 1000-V Charged-Device Model (C101)  
Package Options Include Plastic  
Small-Outline (DW), Shrink Small-Outline  
(DB), and Thin Shrink Small-Outline (PW)  
Packages, Ceramic Chip Carriers (FK), and  
Ceramic (J) DIPs  
9 10 11 12 13  
description  
These octal buffers and line drivers are designed specifically for low-voltage (3.3-V) V operation, but with the  
CC  
capability to provide a TTL interface to a 5-V system environment.  
These devices are organized as two 4-bit buffer/line drivers with separate output-enable (OE) inputs. When OE  
is low, the devices pass data from the A inputs to the Y outputs. When OE is high, the outputs are in the  
high-impedance state.  
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.  
When V is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.  
CC  
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V  
through a pullup resistor;  
CC  
the minimum value of the resistor is determined by the current-sinking capability of the driver.  
These devices are fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the devices when they are powered down.  
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
The SN54LVTH240 is characterized for operation over the full military temperature range of –55°C to 125°C.  
The SN74LVTH240A is characterized for operation from –40°C to 85°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2000, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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