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ꢚ ꢙꢆ ꢇ ꢌ ꢎꢀꢆꢏꢆ ꢕ ꢑ ꢓꢆ ꢛꢓ ꢆ
SCAS352K − MARCH 1994 − REVISED OCTOBER 2003
SN54LVTH241 . . . J OR W PACKAGE
SN74LVTH241 . . . DB, DW, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
)
CC
Support Unregulated Battery Operation
Down to 2.7 V
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
2OE
1Y1
2A4
1Y2
2A3
1Y3
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
A
I
and Power-Up 3-State Support Hot
off
Insertion
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
13 2A2
12 1Y4
D
D
Latch-Up Performance Exceeds 500 mA Per
JESD 17
11
2A1
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
SN54LVTH241 . . . FK PACKAGE
(TOP VIEW)
description/ordering information
3
2 1 20 19
18
These octal buffers/drivers are designed
1A2
2Y3
1A3
2Y2
1A4
1Y1
2A4
1Y2
2A3
1Y3
4
5
6
7
8
specifically for low-voltage (3.3-V) V
operation,
17
16
15
14
CC
with the capability to provide a TTL interface to a
5-V system environment.
The ’LVTH241 devices are organized as two 4-bit
line drivers with separate output-enable (1OE,
2OE) inputs. When 1OE is low or 2OE is high, the
devices pass noninverted data from the A inputs
to the Y outputs. When 1OE is high or 2OE is low,
the outputs are in the high-impedance state.
9 10 11 12 13
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
ORDERING INFORMATION
ORDERABLE
†
T
PACKAGE
TOP-SIDE MARKING
A
PART NUMBER
SN74LVTH241DW
SN74LVTH241DWR
SN74LVTH241NSR
SN74LVTH241DBR
SN74LVTH241PW
SN74LVTH241PWR
SNJ54LVTH241J
Tube
SOIC − DW
LVTH241
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
LVTH241
LXH241
−40°C to 85°C
SSOP − DB
TSSOP − PW
LXH241
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54LVTH241J
SNJ54LVTH241W
SNJ54LVTH241FK
Tube
SNJ54LVTH241W
SNJ54LVTH241FK
−55°C to 125°C
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
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1
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