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SMUN5211DW PDF预览

SMUN5211DW

更新时间: 2024-09-16 06:12:51
品牌 Logo 应用领域
SECOS 晶体晶体管
页数 文件大小 规格书
8页 352K
描述
NPN Multi-Chip Built-in Resistors Transistor

SMUN5211DW 数据手册

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SMUN52XXDW  
NPN Multi-Chip  
Elektronische Bauelemente  
Built-in Resistors Transistor  
The BRT (Bias Resistor Transistor) contains a single transistor  
with a monolithic bias network consisting of two resistors; a series  
base resistor and a base–emitter resistor. These digital transistors are  
designed to replace a single device and its external resistor bias network.  
The BRT eliminates these individual components by integrating them  
into a single device. In the SMUN5211DW series, two BRT devices are  
housed in the SOT–363 package which is ideal for low power surface  
mount applications where board space is at a premium.  
• Simplifies Circuit Design  
SOT-363  
8o  
.055(1.40)  
.047(1.20)  
o
0
.026TYP  
(0.65TYP)  
.021REF  
(0.525)REF  
.053(1.35)  
.045(1.15)  
.096(2.45)  
.085(2.15)  
• Reduces Board Space  
• Reduces Component Count  
• Pb-Free Package is available  
.018(0.46)  
.010(0.26)  
.014(0.35)  
.006(0.15)  
.006(0.15)  
.003(0.08)  
MARKING DIAGRAM  
.087(2.20)  
.079(2.00)  
6
5
4
.004(0.10)  
6
5
4
.000(0.00)  
R1  
R2  
Q2  
.043(1.10)  
.035(0.90)  
.039(1.00)  
.035(0.90)  
7X  
R2  
Q1  
R1  
1
2
3
Dimensions in inches and (millimeters)  
1
2
3
7X = Device Marking  
MAXIMUM RATINGS (T A = 25°C unless otherwise noted, common for Q 1 and Q 2 )  
Rating  
Symbol  
V CBO  
V CEO  
I C  
Value  
50  
Unit  
Vdc  
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
50  
Vdc  
100  
mAdc  
THERMAL CHARACTERISTICS  
Max  
Characteristic (One Junction Heated)  
Symbol  
P D  
Unit  
Note 2  
Note 1  
Total Device Dissipation  
Derate above 25°C  
mW  
T A = 25°C  
187  
1.5  
256  
2.0  
mW/°C  
Thermal Resistance – Junction-to-Ambient  
R
670  
490  
°C/W  
JA  
Max  
Characteristic (Both Junctions Heated)  
Symbol  
Unit  
Note 2  
Note 1  
T A = 25°C  
Total Device Dissipation  
Derate above 25°C  
P D  
250  
2.0  
mW  
385  
3.0  
mW/°C  
Thermal Resistance – Junction-to-Ambient  
Thermal Resistance – Junction-to-Lead  
Junction and Storage Temperature  
R θJA  
493  
188  
°C/W  
°C/W  
°C  
325  
208  
R θJL  
T J , T stg  
–55 to +150  
1. FR–4 @ Minimum Pad  
2. FR–4 @ 1.0 x 1.0 inch Pad  
http://www.SeCoSGmbH.com  
Any changing of specification will not be informed individual  
22-Jun-2007 Rev. A  
Page 1 of 8  

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