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SMUN5230DW1T1G PDF预览

SMUN5230DW1T1G

更新时间: 2024-11-22 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 小信号双极晶体管数字晶体管
页数 文件大小 规格书
21页 140K
描述
双 NPN 双极数字晶体管 (BRT)

SMUN5230DW1T1G 数据手册

 浏览型号SMUN5230DW1T1G的Datasheet PDF文件第2页浏览型号SMUN5230DW1T1G的Datasheet PDF文件第3页浏览型号SMUN5230DW1T1G的Datasheet PDF文件第4页浏览型号SMUN5230DW1T1G的Datasheet PDF文件第5页浏览型号SMUN5230DW1T1G的Datasheet PDF文件第6页浏览型号SMUN5230DW1T1G的Datasheet PDF文件第7页 
MUN5211DW1T1 Series  
Preferred Devices  
Dual Bias Resistor  
Transistors  
NPN Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
The BRT (Bias Resistor Transistor) contains a single transistor with  
a monolithic bias network consisting of two resistors; a series base  
resistor and a base−emitter resistor. These digital transistors are  
designed to replace a single device and its external resistor bias  
network. The BRT eliminates these individual components by  
integrating them into a single device. In the MUN5211DW1T1 series,  
two BRT devices are housed in the SOT−363 package which is ideal  
for low power surface mount applications where board space is at a  
premium.  
http://onsemi.com  
(3)  
(2)  
(1)  
R
1
R
2
Q
1
Q
2
R
2
R
1
Features  
(4)  
(5)  
(6)  
Simplifies Circuit Design  
Reduces Board Space  
Reduces Component Count  
Pb−Free Packages are Available  
1
MAXIMUM RATINGS  
(T = 25°C unless otherwise noted, common for Q and Q )  
A
SOT−363  
CASE 419B  
STYLE 1  
1
2
Rating  
Symbol  
Value  
50  
Unit  
Vdc  
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
V
V
CBO  
CEO  
50  
Vdc  
MARKING DIAGRAM  
I
100  
mAdc  
C
6
THERMAL CHARACTERISTICS  
xx M G  
Characteristic  
(One Junction Heated)  
G
Symbol  
Max  
Unit  
Total Device Dissipation  
P
187 (Note 1)  
256 (Note 2)  
1.5 (Note 1)  
2.0 (Note 2)  
mW  
1
D
T = 25°C  
A
Derate above 25°C  
mW/°C  
°C/W  
xx  
M
G
= Device Code  
= Date Code*  
= Pb−Free Package  
Thermal Resistance,  
Junction-to-Ambient  
R
q
670 (Note 1)  
490 (Note 2)  
JA  
(Note: Microdot may be in either location)  
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
Characteristic  
(Both Junctions Heated)  
Symbol  
Max  
Unit  
Total Device Dissipation  
P
250 (Note 1)  
385 (Note 2)  
2.0 (Note 1)  
3.0 (Note 2)  
mW  
D
T = 25°C  
A
DEVICE MARKING INFORMATION  
See specific marking information in the device marking table  
on page 2 of this data sheet.  
Derate above 25°C  
mW/°C  
°C/W  
°C/W  
°C  
Thermal Resistance,  
Junction-to-Ambient  
R
q
493 (Note 1)  
325 (Note 2)  
JA  
Preferred devices are recommended choices for future use  
and best overall value.  
Thermal Resistance,  
Junction-to-Lead  
R
q
188 (Note 1)  
208 (Note 2)  
JL  
Junction and Storage Temperature  
T , T  
J
55 to +150  
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. FR−4 @ Minimum Pad  
2. FR−4 @ 1.0 x 1.0 inch Pad  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
December, 2005 − Rev. 7  
MUN5211DW1T1/D  
 

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