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SKM50GB063D PDF预览

SKM50GB063D

更新时间: 2024-11-04 22:07:27
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON 双极性晶体管
页数 文件大小 规格书
6页 169K
描述
SEMITRANS M Superfast NPT-IGBT Modules

SKM50GB063D 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DO-204
包装说明:FLANGE MOUNT, R-XUFM-X7针数:2
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.81其他特性:UL RECOGNIZED
外壳连接:ISOLATED最大集电极电流 (IC):70 A
集电极-发射极最大电压:600 V配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
门极-发射极最大电压:20 VJESD-30 代码:R-XUFM-X7
JESD-609代码:e3/e4元件数量:2
端子数量:7最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
参考标准:IEC-60747-1子类别:Insulated Gate BIP Transistors
表面贴装:NO端子面层:TIN/SILVER
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):330 ns
标称接通时间 (ton):90 nsVCEsat-Max:2.5 V
Base Number Matches:1

SKM50GB063D 数据手册

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SEMITRANS® M  
Superfast NPT-IGBT  
Modules  
Absolute Maximum Ratings  
Symbol Conditions 1)  
VCES  
Values  
Units  
V
V
A
A
600  
600  
70 / 50  
140 / 100  
± 20  
VCGR  
IC  
RGE = 20 kΩ  
Tcase = 25/75 °C  
SKM 50 GB 063 D  
ICM  
Tcase = 25/75 °C; tp = 1 ms  
VGES  
Ptot  
V
per IGBT, Tcase = 25 °C  
250  
W
°C  
V
Tj, (Tstg  
Visol  
)
–40 ... +150 (125)  
2500  
AC, 1 min.  
humidity DIN 40040  
Class F  
40/125/56  
climate  
DIN IEC 68 T.1  
Inverse Diode  
IF = –IC  
T
case = 25/80 °C  
75 / 50  
140 / 100  
440  
A
A
IFM = –ICM Tcase = 25/80 °C; tp = 1 ms  
IFSM  
I2t  
tp = 10 ms; sin.; Tj = 150 °C  
tp = 10 ms; Tj = 150 °C  
A
SEMITRANS 2  
970  
A2s  
Characteristics  
Symbol Conditions 1)  
min.  
typ.  
max.  
Units  
V(BR)CES VGE = 0, IC = 1,5 mA  
VCES  
4,5  
5,5  
0,1  
3
1,8(2,0)  
2,1(2,4)  
6,5  
1,5  
100  
V
V
mA  
mA  
nA  
V
VGE(th)  
ICES  
VGE = VCE, IC = 1 mA  
VGE = 0 Tj = 25 °C  
CE = VCES Tj = 125 °C  
VGE = 20 V, VCE = 0  
GB  
V
Features  
IGES  
N channel, homogeneous Silicon  
structure (NPT- Non punch-  
through IGBT)  
VCEsat  
VCEsat  
gfs  
IC = 30 A  
IC = 50 A  
VCE = 20 V, IC = 50 A  
VGE = 15 V;  
Tj = 25 (125) °C  
2,5(2,8)  
V
S
20  
Low tail current with low  
temperature dependence  
CCHC  
Cies  
Coes  
Cres  
LCE  
per IGBT  
2800  
300  
200  
350  
30  
pF  
pF  
pF  
pF  
nH  
VGE = 0  
High short circuit capability, self  
limiting if term. G is clamped to E  
Pos. temp.-coeff. of VCEsat  
50 % less turn off losses 9)  
30 % less short circuit current 9)  
VCE = 25 V  
f = 1 MHz  
td(on)  
tr  
td(off)  
tf  
Eon  
Eoff  
VCC = 300 V  
50  
40  
300  
30  
2,5  
1,8  
ns  
ns  
ns  
ns  
mWs  
mWs  
VGE = –15 V / +15 V3)  
IC = 50 A, ind. load  
RGon = RGoff = 22 Ω  
Tj = 125 °C  
9)  
Very low Cies, Coes, Cres  
Latch-up free  
Fast & soft inverse CAL diodes 8)  
Isolated copper baseplate using  
DCB Direct Copper Bonding  
Technology without hard mould  
Large clearance (10 mm) and  
creepage distances (20 mm)  
Typical Applications  
Inverse Diode 8)  
VF = VEC IF = 50 A  
VGE = 0 V;  
Tj = 25 (125 °C)  
1,45(1,35)  
1,7  
V
VTO  
rt  
IRRM  
Qrr  
Tj = 125 °C  
Tj = 125 °C  
0,9  
15  
V
mΩ  
A
10  
31  
3,2  
IF = 50 A; Tj = 125 °C2)  
IF = 50 A; Tj = 125 °C2)  
Switching (not for linear use)  
Switched mode power supplies  
UPS  
µC  
Thermal characteristics  
Rthjc  
Rthjc  
Rthch  
per IGBT  
per diode  
per module  
0,5  
1,0  
0,05  
°C/W  
°C/W  
°C/W  
Three phase inverters for servo /  
AC motor speed control  
Pulse frequencies also above  
10 kHz  
1)  
T
= 25 °C, unless otherwise  
case  
specified  
2) IF = – IC, VR = 300 V,  
–diF/dt = 800 A/µs, VGE = 0 V  
3) Use VGEoff = –5... –15 V  
8) CAL = Controlled Axial Lifetime  
Technology  
9) Compared to PT-IGBT  
Cases and mech. data B 6 – 12  
© by SEMIKRON  
0898  
B 6 7  

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