SiRA74DP
Vishay Siliconix
www.vishay.com
N-Channel 40 V (D-S) 150 °C MOSFET
FEATURES
PowerPAK® SO-8 Single
• TrenchFET® Gen IV power MOSFET
• Tuned for the lowest RDS-Qoss FOM
• 100 % Rg and UIS tested
D
D
7
8
D
6
D
5
• Qgd/Qgs ratio < 1 optimizes switching characteristics
• Optimized for wave soldering
• Flexible leads increase resilience to board flexing
1
S
2
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
3
4
G
S
1
Top View
Bottom View
D
APPLICATIONS
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
• Synchronous rectification
• High power density DC/DC
40
0.0042
0.0061
12.4
G
• DC/AC inverters
R
DS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
D (A) a
Configuration
• Switch mode power supplies
S
I
81.2
Single
N-Channel MOSFET
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
SiRA74DP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
40
+20 / -16
81.2
64.2
24 b
19.2 b
150
42
3.7 b, c
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
20
20
46.2
29.6
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA =70 °C
Maximum power dissipation
PD
4.1 b
2.6 b
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJC
TYPICAL
25
MAXIMUM
UNIT
t < 10 s
Steady state
30
2.7
°C/W
Maximum junction-to-case (drain)
2.1
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 75 °C/W
S20-0500-Rev. A, 29-Jun-2020
Document Number: 77640
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000