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SiRC06DP PDF预览

SiRC06DP

更新时间: 2024-11-22 14:55:51
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威世 - VISHAY /
页数 文件大小 规格书
9页 202K
描述
N-Channel 30 V (D-S) MOSFET With Schottky Diode

SiRC06DP 数据手册

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SiRC06DP  
Vishay Siliconix  
www.vishay.com  
N-Channel 30 V (D-S) MOSFET With Schottky Diode  
FEATURES  
PowerPAK® SO-8 Single  
D
• TrenchFET® Gen IV power MOSFET  
• SkyFET® with monolithic Schottky diode  
• 100 % Rg and UIS tested  
D
7
8
D
6
D
5
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S
2
3
S
4
G
S
1
D
APPLICATIONS  
Top View  
Bottom View  
• Personal computers and servers  
• Synchronous buck  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) max. (Ω) at VGS = 10 V  
DS(on) max. (Ω) at VGS = 4.5 V  
Qg typ. (nC)  
D (A) a, g  
Configuration  
Schottky  
Diode  
30  
• Synchronous rectification  
G
0.0027  
0.0040  
17.5  
• DC/DC conversion  
R
I
60  
S
N-Channel MOSFET  
Single  
ORDERING INFORMATION  
Package  
PowerPAK SO-8  
Lead (Pb)-free and halogen-free  
SiRC06DP-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
30  
+20, -16  
60 g  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
VGS  
V
TC = 25 °C  
C = 70 °C  
TA = 25 °C  
TA = 70 °C  
T
60 g  
Continuous drain current (TJ = 150 °C)  
ID  
32 b, c  
25.6 b, c  
100  
60 g  
7.1 b, c  
15  
11.25  
50  
32  
5 b, c  
A
Pulsed drain current (t = 300 μs)  
IDM  
IS  
TC = 25 °C  
Continuous source-drain diode current  
TA = 25 °C  
L = 0.3 mH  
TC = 25 °C  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
mJ  
W
TC = 70 °C  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
3.2 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b,f  
SYMBOL  
RthJA  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
20  
25  
°C/W  
Maximum junction-to-case (drain)  
RthJC  
1.9  
2.5  
Notes  
a. Based on TC = 25 °C  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 70 °C/W  
g. Package limit  
S21-0841-Rev. B, 09-Aug-2021  
Document Number: 62942  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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