SiRC06DP
Vishay Siliconix
www.vishay.com
N-Channel 30 V (D-S) MOSFET With Schottky Diode
FEATURES
PowerPAK® SO-8 Single
D
• TrenchFET® Gen IV power MOSFET
• SkyFET® with monolithic Schottky diode
• 100 % Rg and UIS tested
D
7
8
D
6
D
5
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
1
S
2
3
S
4
G
S
1
D
APPLICATIONS
Top View
Bottom View
• Personal computers and servers
• Synchronous buck
PRODUCT SUMMARY
VDS (V)
RDS(on) max. (Ω) at VGS = 10 V
DS(on) max. (Ω) at VGS = 4.5 V
Qg typ. (nC)
D (A) a, g
Configuration
Schottky
Diode
30
• Synchronous rectification
G
0.0027
0.0040
17.5
• DC/DC conversion
R
I
60
S
N-Channel MOSFET
Single
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
SiRC06DP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
30
+20, -16
60 g
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
C = 70 °C
TA = 25 °C
TA = 70 °C
T
60 g
Continuous drain current (TJ = 150 °C)
ID
32 b, c
25.6 b, c
100
60 g
7.1 b, c
15
11.25
50
32
5 b, c
A
Pulsed drain current (t = 300 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
L = 0.3 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
mJ
W
TC = 70 °C
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
3.2 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b,f
SYMBOL
RthJA
TYPICAL
MAXIMUM
UNIT
t ≤ 10 s
Steady state
20
25
°C/W
Maximum junction-to-case (drain)
RthJC
1.9
2.5
Notes
a. Based on TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 70 °C/W
g. Package limit
S21-0841-Rev. B, 09-Aug-2021
Document Number: 62942
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000