SiRS4400DP
Vishay Siliconix
www.vishay.com
N-Channel 40 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8S Single
• TrenchFET® Gen IV power MOSFET
D
D
7
8
• Very low RDS x Qg figure-of-merit (FOM)
• Leadership RDS(on) minimizes power loss from
conduction
D
6
D
5
• 100 % Rg and UIS tested
• Enhance power dissipation and lower RthJC
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
S
2
3
S
G
D
APPLICATIONS
Top View
Bottom View
• Synchronous rectification
• DC/DC converters
• OR-ing and hot swap switch
• Power supplies
• Motor drive control
PRODUCT SUMMARY
VDS (V)
40
0.00069
0.00096
90
G
R
DS(on) max. () at VGS = 10 V
DS(on) max. () at VGS = 4.5 V
R
Qg typ. (nC)
D (A) a
Configuration
S
• Battery management
I
440
N-Channel MOSFET
Single
ORDERING INFORMATION
Package
PowerPAK SO-8S
Lead (Pb)-free and halogen-free
SiRS4400DP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
40
+20 / -16
440
UNIT
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
352
Continuous drain current (TJ = 150 °C)
ID
77 b, c
62 b, c
500
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
218
6.7 b, c
65
211
240
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
mJ
W
TC = 70 °C
154
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
7.4 b, c
4.7 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
RthJA
RthJC
TYPICAL
13
MAXIMUM
17
UNIT
Maximum junction-to-ambient b
t 10 s
Steady state
°C/W
Maximum junction-to-case (drain)
0.4
0.52
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 52 °C/W
S23-0559-Rev. B, 17-Jul-2023
Document Number: 62234
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000