Datasheet > SiRS4302DP

SiRS4302DP

更新时间： 2024-11-22 14:52:27

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
8页	232K
描述
N-Channel 30 V (D-S) MOSFET

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SiRS4302DP 数据手册

SiRS4302DP

Vishay Siliconix

www.vishay.com

N-Channel 30 V (D-S) MOSFET

FEATURES

PowerPAK^®SO-8S Single

• TrenchFET^®Gen IV power MOSFET

• Very low R_DSx Q_gfigure-of-merit (FOM)

• 100 % R_gand UIS tested

• Enhance power dissipation and lower R_thJC

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

• Synchronous rectification

• DC/DC converters

Top View

Bottom View

• OR-ing and hot swap switch

• Battery management

PRODUCT SUMMARY

V_DS(V)

0.00057

0.00083

R_DS(on)max. () at V_GS= 10 V

R_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

N-Channel MOSFET

_D(A) ^a

478

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK SO-8S

Lead (Pb)-free and halogen-free

SiRS4302DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

UNIT

V_DS

V_GS

+20, -16

478

382

87 ^{b, c}

70 ^{b, c}

600

T_C= 25 °C

_C= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

189

6.2 ^{b, c}

Continuous source-drain diode current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

211

208

133

T_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

6.9 ^{b, c}

4.4 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

Maximum junction-to-ambient ^b

t  10 s

Steady state

°C/W

Maximum junction-to-case (drain)

R_thJC

0.46

0.60

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 55 °C/W

S23-0400-Rev. B, 05-Jun-2023

Document Number: 62190

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7 8

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