Datasheet > SiRC10DP

SiRC10DP

更新时间： 2024-11-26 14:55:23

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威世 - VISHAY		/
页数	文件大小	规格书
9页	229K
描述
N-Channel 30 V (D-S) MOSFET With Schottky Diode

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SiRC10DP 数据手册

SiRC10DP

Vishay Siliconix

www.vishay.com

N-Channel 30 V (D-S) MOSFET With Schottky Diode

FEATURES

PowerPAK^®SO-8 Single

• TrenchFET^®Gen IV power MOSFET

• SKYFET^®with monolithic Schottky diode

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Synchronous buck

Top View

Bottom View

• Synchronous rectification

Schottky

Diode

PRODUCT SUMMARY

V_DS(V)

• DC/DC conversion

R_DS(on)max. (Ω) at V_GS= 10 V

0.0035

0.0052

11.2

60 ^{a, g}

Single

_DS(on)max. (Ω) at V_GS= 4.5 V

Q_gtyp. (nC)

_D(A)

Configuration

N-Channel MOSFET

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK SO-8 Single

SiRC10DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-source voltage

Gate-source voltage

V_DS

+20 / -16

60 ^a

V_GS

T_C= 25 °C

_C= 70 °C

T_A= 25 °C

T_A= 70 °C

60 ^a

Continuous drain current (T_J= 150 °C)

I_D

23.9 ^{b, c}

19.1 ^{b, c}

150

3.2 ^{b, c}

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

11.25

27.5

3.6^{, c}

2.3 ^{b, c}

-55 to +150

260

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t ≤ 10 s

Steady state

2.9

°C/W

Maximum junction-to-case (drain)

2.3

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 70 °C/W.

g. T_C= 25 °C.

S21-0840-Rev. B, 09-Aug-2021

Document Number: 75189

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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