Datasheet > SiDR220EP

SiDR220EP

更新时间： 2024-11-22 14:53:11

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	207K
描述
N-Channel 25 V (D-S) 175 °C MOSFET

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SiDR220EP 数据手册

SiDR220EP

Vishay Siliconix

www.vishay.com

N-Channel 25 V (D-S) 175 °C MOSFET

FEATURES

PowerPAK^®SO-8DC

• TrenchFET^®Gen IV power MOSFET

• Optimized Q_g, Q_gd, and Q_gd/Q_gsratio reduces

switching related power loss

• Top side cooling feature provides additional

venue for thermal transfer

• 100 % R_gand UIS tested

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Top View

Bottom View

APPLICATIONS

PRODUCT SUMMARY

V_DS(V)

• Synchronous rectification

• High power density DC/DC

_DS(on)max. (Ω) at V_GS= 10 V

_DS(on)max. (Ω) at V_GS= 4.5 V

0.00058

0.00082

• Synchronous buck converter

Q_gtyp. (nC)

• OR-ing

I_D(A)

415

• Load switching

Configuration

Single

• Battery management

N-Channel MOSFET

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK SO-8DC

SiDR220EP-T1-RE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

+16 / -12

415

347

92.8 ^{b, c}

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

Continuous drain current (T_J= 150 °C)

I_D

T_A= 70 °C

77.6 ^{b, c}

Pulsed drain current (t = 100 μs)

I_DM

I_S

500

136

6.8 ^{b, c}

T_C= 25 °C

T_A= 25 °C

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

180

150

105

6.25 ^{b, c}

4 ^{b, c}

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

-55 to +175

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

Maximum junction-to-case (drain)

Maximum junction-to-case (source)

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t ≤ 10 s

Steady state

1.4

0.8

1.1

°C/W

R_thJC

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8DC is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 54 °C/W

g. T_C= 25 °C

S21-0498-Rev. A, 17-May-2021

Document Number: 63083

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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