SiDR622DP
Vishay Siliconix
www.vishay.com
N-Channel 150 V (D-S) MOSFET
FEATURES
• TrenchFET® power MOSFET
PowerPAK® SO-8DC
D
8
D
7
D
• 100 % Rg and UIS tested
D
6
5
• Top side cooling feature provides additional
venue for thermal transfer
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
S
2
S
3
S
1
4
G
D
APPLICATIONS
Top View
Bottom View
• Synchronous rectification
• Primary side switching
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
150
0.0177
0.0204
20.7
• High power density DC/DC
G
• H-bridge
R
DS(on) max. () at VGS = 7.5 V
• Motor drive control
Qg typ. (nC)
ID (A) a
56.7
S
Configuration
Single
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
Lead (Pb)-free and halogen-free
PowerPAK SO-8DC
SiDR622DP-T1-GE3
SiDR622DP-T1-RE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
150
20
UNIT
VDS
VGS
V
T
T
C = 25 °C
C = 70 °C
56.7
45.3
64.6 b, c
51.7 b, c
100
60 g
5.6 b, c
40
80
125
Continuous drain current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single pulse avalanche current
Single pulse avalanche Energy
IAS
EAS
mJ
W
T
C = 70 °C
80
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
6.25 b, c
4 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
RthJA
RthJC
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
Maximum junction-to-case (source)
t 10 s
Steady state
Steady state
15
0.8
1.1
20
1
1.4
°C/W
RthJC
Notes
a. Based on TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8DC is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 54 °C/W
g. Package limited
S22-0862-Rev. B, 24-Oct-2022
Document Number: 75951
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000