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SiDR622DP PDF预览

SiDR622DP

更新时间: 2024-11-26 14:55:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 234K
描述
N-Channel 150 V (D-S) MOSFET

SiDR622DP 数据手册

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SiDR622DP  
Vishay Siliconix  
www.vishay.com  
N-Channel 150 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PowerPAK® SO-8DC  
D
8
D
7
D
• 100 % Rg and UIS tested  
D
6
5
• Top side cooling feature provides additional  
venue for thermal transfer  
S
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
1
S
2
S
3
S
1
4
G
D
APPLICATIONS  
Top View  
Bottom View  
• Synchronous rectification  
• Primary side switching  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) max. () at VGS = 10 V  
150  
0.0177  
0.0204  
20.7  
• High power density DC/DC  
G
• H-bridge  
R
DS(on) max. () at VGS = 7.5 V  
• Motor drive control  
Qg typ. (nC)  
ID (A) a  
56.7  
S
Configuration  
Single  
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and halogen-free  
Lead (Pb)-free and halogen-free  
PowerPAK SO-8DC  
SiDR622DP-T1-GE3  
SiDR622DP-T1-RE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-source voltage  
Gate-source voltage  
SYMBOL  
LIMIT  
150  
20  
UNIT  
VDS  
VGS  
V
T
T
C = 25 °C  
C = 70 °C  
56.7  
45.3  
64.6 b, c  
51.7 b, c  
100  
60 g  
5.6 b, c  
40  
80  
125  
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
Continuous source-drain diode current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
Single pulse avalanche current  
Single pulse avalanche Energy  
IAS  
EAS  
mJ  
W
T
C = 70 °C  
80  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
6.25 b, c  
4 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
MAXIMUM  
UNIT  
Maximum junction-to-ambient b, f  
Maximum junction-to-case (drain)  
Maximum junction-to-case (source)  
t 10 s  
Steady state  
Steady state  
15  
0.8  
1.1  
20  
1
1.4  
°C/W  
RthJC  
Notes  
a. Based on TC = 25 °C  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8DC is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 54 °C/W  
g. Package limited  
S22-0862-Rev. B, 24-Oct-2022  
Document Number: 75951  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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