SiDR392DP
Vishay Siliconix
www.vishay.com
N-Channel 30 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8DC
• TrenchFET® Gen IV power MOSFET
D
8
D
7
D
• Top side cooling feature provides additional
venue for thermal transfer
D
6
5
S
• Optimized Qg, Qgd, and Qgd/Qgs ratio reduces
switching related power loss
1
S
• 100 % Rg and UIS tested
2
S
3
S
1
4
G
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Top View
Bottom View
APPLICATIONS
D
PRODUCT SUMMARY
VDS (V)
• Synchronous rectification
• High power density DC/DC
30
0.00062
RDS(on) max. () at VGS = 10 V
• Synchronous buck converter
• OR-ing
• Load switching
• Battery management
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
0.00093
59.7
100 a, g
G
ID (A)
N-Channel MOSFET
Configuration
Single
S
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SO-8DC
SiDR392DP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
30
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
+20 / -16
100 a
100 a
82 b, c
66 b, c
200
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
100
5.6 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
45
101
125
80
6.25 b, c
4 b, c
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
Maximum junction-to-case (drain)
Maximum junction-to-case (source)
SYMBOL
RthJA
RthJC
TYPICAL
15
MAXIMUM
UNIT
t 10 s
Steady state
Steady state
20
1
1.4
0.8
1.1
°C/W
RthJC
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8DC is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 54 °C/W
g. TC = 25 °C
S18-0243-Rev. A, 26-Feb-18
Document Number: 76351
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000