Datasheet > SiDR610DP

SiDR610DP

更新时间： 2024-11-26 14:55:19

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	225K
描述
N-Channel 200 V (D-S) MOSFET

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SiDR610DP 数据手册

SiDR610DP

Vishay Siliconix

www.vishay.com

N-Channel 200 V (D-S) MOSFET

FEATURES

• TrenchFET^®technology optimizes balance of

_DS(on), Q_g, Q_sw, and Q_oss

PowerPAK^®SO-8DC

• Tuned for the lowest R_DS- Q_ossFOM

• Top side cooling feature provides additional

venue for thermal transfer

• 100 % R_gand UIS tested

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Top View

Bottom View

APPLICATIONS

• Fixed telecom

PRODUCT SUMMARY

V_DS(V)

200

0.0319

0.0334

• DC/DC converter

R_DS(on)max. () at V_GS= 10 V

• Primary and secondary side switch

R_DS(on)max. () at V_GS= 7.5 V

Q_gtyp. (nC)

• Synchronous rectification

_D(A) ^a

39.6

• Power supplies

Configuration

Single

• Class D amplifier

N-Channel MOSFET

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK SO-8DC

SiDR610DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

200

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

39.6

31.7

8.9 ^{b, c}

7.1 ^{b, c}

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

39.6

5.6 ^{b, c}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

125

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

P_D

6.25 ^{b, c}

4 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, f}

Maximum junction-to-case (drain)

Maximum junction-to-case (source)

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

1.4

0.8

1.1

°C/W

R_thJC

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8DC is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 54 °C/W

S17-1313-Rev. A, 21-Aug-17

Document Number: 75649

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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