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SiDR570EP PDF预览

SiDR570EP

更新时间: 2024-11-26 14:52:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 222K
描述
N-Channel 150 V (D-S) 175 °C MOSFET

SiDR570EP 数据手册

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SiDR570EP  
Vishay Siliconix  
www.vishay.com  
N-Channel 150 V (D-S) 175 °C MOSFET  
FEATURES  
PowerPAK® SO-8DC  
• TrenchFET® Gen V power MOSFET  
• Very low RDS - Qg figure-of-merit (FOM)  
• Tuned for the lowest RDS - Qoss FOM  
• 100 % Rg and UIS tested  
D
8
D
7
D
D
6
5
S
• Material categorization: for definitions of  
compliance please see www.vishay.com/doc?99912  
1
S
2
S
3
S
1
4
G
APPLICATIONS  
D
• Synchronous rectification  
• Primary side switch  
Top View  
Bottom View  
• DC/DC converters  
G
PRODUCT SUMMARY  
VDS (V)  
• OR-ing and hot swap switch  
• Power supplies  
150  
0.0079  
0.0085  
35.1  
R
DS(on) max. (Ω) at VGS = 10 V  
DS(on) max. (Ω) at VGS = 7.5 V  
S
R
• Motor drive control  
N-Channel MOSFET  
Qg typ. (nC)  
D (A)  
• Battery management  
I
90.9  
Configuration  
Single  
ORDERING INFORMATION  
Package  
PowerPAK SO-8DC  
SiDR570EP-T1-RE3  
Lead (Pb)-free and halogen-free  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
150  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
C = 70 °C  
90.9 a  
76 a  
30.8 b, c  
25.8 b, c  
200  
T
Continuous drain current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
136  
6.8 b, c  
Continuous source-drain diode current  
TA = 25 °C  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
30  
L = 0.1 mH  
EAS  
45  
mJ  
W
T
C = 25 °C  
C = 70 °C  
150  
T
105  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
7.5 b, c  
5.25 b, c  
-55 to +175  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
S21-1180-Rev. A, 06-Dec-2021  
Document Number: 63154  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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