Datasheet > SiDR608DP

SiDR608DP

更新时间： 2024-11-26 14:54:15

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	224K
描述
N-Channel 45 V (D-S) MOSFET

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SiDR608DP 数据手册

SiDR608DP

Vishay Siliconix

www.vishay.com

N-Channel 45 V (D-S) MOSFET

FEATURES

PowerPAK^®SO-8DC

• TrenchFET^®Gen IV power MOSFET

• 45 V Drain-source break-down voltage

• Tuned for low Q_gand Q_oss

• 100 % R_gand UIS tested

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• Synchronous rectification

• High power density DC/DC

PRODUCT SUMMARY

V_DS(V)

• Motor drive control

R_DS(on)max. () at V_GS= 10 V

R_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

0.00120

0.00180

50.5

I_D(A) ^a

208

N-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK SO-8DC

SiDR608DP-T1-RE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

+20, -16

208

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

166

Continuous drain current (T_J= 150 °C)

I_D

51 ^{b, c}

40.8 ^{b, c}

400

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

94.5

5.6 ^{b, c}

125

104

66.6

6.25 ^{b, c}

4 ^{b, c}

Continuous source-drain diode current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Single pulse avalanche current

Single pulse avalanche Energy

I_AS

E_AS

T_C= 70 °C

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

-55 to +150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

Maximum junction-to-ambient ^{b, f}

Maximum junction-to-case (drain)

Maximum junction-to-case (source)

t  10 s

Steady state

1.2

1.4

0.9

1.1

°C/W

R_thJC

Notes

a. Based on T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8DC is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 54 °C/W

g. Package limited

S19-0390-Rev. A, 29-Apr-2019

Document Number: 77086

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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与SiDR608DP相关器件

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