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NTD4906N-1G PDF预览

NTD4906N-1G

更新时间: 2024-11-06 06:00:47
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管
页数 文件大小 规格书
8页 140K
描述
Power MOSFET 30 V, 54 A, Single N−Channel, DPAK/IPAK

NTD4906N-1G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:IN-LINE, R-PSIP-T3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.16Base Number Matches:1

NTD4906N-1G 数据手册

 浏览型号NTD4906N-1G的Datasheet PDF文件第2页浏览型号NTD4906N-1G的Datasheet PDF文件第3页浏览型号NTD4906N-1G的Datasheet PDF文件第4页浏览型号NTD4906N-1G的Datasheet PDF文件第5页浏览型号NTD4906N-1G的Datasheet PDF文件第6页浏览型号NTD4906N-1G的Datasheet PDF文件第7页 
NTD4906N  
Power MOSFET  
30 V, 54 A, Single NChannel, DPAK/IPAK  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
These are PbFree Devices  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Applications  
5.5 mW @ 10 V  
8.0 mW @ 4.5 V  
CPU Power Delivery  
DCDC Converters  
30 V  
54 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Continuous Drain  
Symbol  
Value  
30  
Unit  
V
V
DSS  
NChannel  
V
GS  
"20  
14  
V
G
I
D
A
T = 25°C  
A
Current (R  
(Note 1)  
)
q
JA  
T = 100°C  
A
9.9  
2.6  
S
4
Power Dissipation  
(R ) (Note 1)  
T = 25°C  
A
P
W
A
D
D
D
4
q
JA  
4
Continuous Drain  
I
D
T = 25°C  
A
10.3  
7.3  
Current (R ) (Note  
q
JA  
T = 100°C  
A
Steady  
State  
2)  
2
1
1
2
3
3
1
2
3
CASE 369D  
IPAK  
(Straight Lead  
DPAK)  
Power Dissipation  
(R ) (Note 2)  
T = 25°C  
A
P
I
1.38  
W
A
q
JA  
CASE 369AD  
IPAK  
(Straight Lead)  
CASE 369AA  
DPAK  
(Bent Lead)  
STYLE 2  
Continuous Drain  
T
= 25°C  
= 100°C  
= 25°C  
54  
38  
D
C
C
Current (R  
(Note 1)  
)
q
JC  
T
C
Power Dissipation  
(R ) (Note 1)  
T
P
37.5  
W
q
JC  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Pulsed Drain Current t =10ms T = 25°C  
I
223  
90  
A
A
p
A
DM  
I
DmaxPkg  
4
Current Limited by Package  
T = 25°C  
A
Drain  
4
4
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
Drain  
Drain  
Source Current (Body Diode)  
Drain to Source dV/dt  
I
32  
6.5  
48  
A
S
dV/dt  
V/ns  
mJ  
Single Pulse DraintoSource Avalanche  
E
AS  
Energy (T = 25°C, V = 50 V, V = 10 V,  
J
DD  
GS  
2
1
2
3
L = 0.1 mH, I  
= 31 A, R = 25 W)  
Drain  
L(pk)  
G
1
3
Gate Drain Source  
Gate Source  
1
2
3
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Gate Drain Source  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Y
WW  
= Year  
= Work Week  
4906N = Device Code  
= PbFree Package  
G
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
June, 2009 Rev. 1  
NTD4906N/D  

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