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NTD4910N PDF预览

NTD4910N

更新时间: 2024-11-06 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 136K
描述
Power MOSFET 30 V, 37 A, Single N−Channel, DPAK/IPAK

NTD4910N 数据手册

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NTD4910N  
Power MOSFET  
30 V, 37 A, Single NChannel, DPAK/IPAK  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
These are PbFree Devices  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Applications  
9.0 mW @ 10 V  
13 mW @ 4.5 V  
CPU Power Delivery  
DCDC Converters  
30 V  
37 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Continuous Drain  
Symbol  
Value  
30  
Unit  
V
V
DSS  
NChannel  
V
GS  
"20  
11.2  
V
G
I
D
A
T = 25°C  
A
Current (R  
(Note 1)  
)
q
JA  
T = 100°C  
A
7.9  
2.6  
S
4
Power Dissipation  
(R ) (Note 1)  
T = 25°C  
A
P
W
A
D
D
D
4
q
JA  
4
Continuous Drain  
I
D
T = 25°C  
A
8.2  
5.8  
Current (R  
(Note 2)  
)
q
JA  
T = 100°C  
A
Steady  
State  
2
1
1
2
3
3
1
2
3
CASE 369D  
IPAK  
(Straight Lead  
DPAK)  
Power Dissipation  
(R ) (Note 2)  
T = 25°C  
A
P
I
1.37  
W
A
q
JA  
CASE 369AD  
IPAK  
(Straight Lead)  
CASE 369AA  
DPAK  
(Bent Lead)  
STYLE 2  
Continuous Drain  
T
= 25°C  
= 100°C  
= 25°C  
37  
26  
D
C
C
Current (R  
(Note 1)  
)
q
JC  
T
C
Power Dissipation  
(R ) (Note 1)  
T
P
27.3  
W
q
JC  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Pulsed Drain Current t =10ms T = 25°C  
I
152  
60  
A
A
p
A
DM  
I
DmaxPkg  
4
Current Limited by Package  
T = 25°C  
A
Drain  
4
4
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
Drain  
Drain  
Source Current (Body Diode)  
Drain to Source dV/dt  
I
23  
7.0  
A
S
dV/dt  
V/ns  
mJ  
Single Pulse DraintoSource Avalanche  
E
AS  
25.3  
Energy (T = 25°C, V = 50 V, V = 10 V,  
J
DD  
GS  
2
1
2
3
L = 0.1 mH, I  
= 22.5 A, R = 25 W)  
Drain  
L(pk)  
G
1
3
Gate Drain Source  
Gate Source  
1
2
3
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
Gate Drain Source  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 in sq pad size, 1 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
Y
WW  
= Year  
= Work Week  
4910N = Device Code  
= PbFree Package  
G
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
June, 2009 Rev. 0  
NTD4910N/D  
 

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