NST489AMT1,
NSVT489AMT1G
High Current Surface Mount
NPN Silicon Low VCE(sat)
Switching Transistor for
Load Management in
http://onsemi.com
30 VOLTS, 3.0 AMPS
NPN TRANSISTOR
Portable Applications
Features
AEC−Q101 Qualified and PPAP Capable
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
Pb−Free Packages are Available*
TSOP−6
CASE 318G
STYLE 6
COLLECTOR
1, 2, 5, 6
MAXIMUM RATINGS (T = 25C)
A
Rating
Symbol
Max
30
Unit
V
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
V
CEO
V
CBO
V
EBO
3
BASE
50
V
5.0
2.0
3.0
V
4
Collector Current − Continuous
Collector Current − Peak
I
C
A
EMITTER
I
A
CM
DEVICE MARKING
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation
P
D
(Note 1)
N2 M G
T = 25C
535
4.3
mW
mW/C
G
A
Derate above 25C
Thermal Resistance,
Junction−to−Ambient
R
(Note 1)
C/W
q
JA
234
N2 = Specific Device Code
Total Device Dissipation
P
D
(Note 2)
M
= Date Code*
T = 25C
1.180
9.4
W
mW/C
A
G
= Pb−Free Package
Derate above 25C
(Note: Microdot may be in either location)
Thermal Resistance,
Junction−to−Ambient
R
(Note 2)
C/W
q
JA
*Date Code orientation may vary depending upon
manufacturing location.
106
Thermal Resistance,
Junction−to−Lead #1
R
R
(Note 1)
(Note 2)
110
50
C/W
C/W
q
JL
JL
q
ORDERING INFORMATION
Total Device Dissipation
(Single Pulse < 10 s)
P
W
Dsingle
†
Device
Package
Shipping
(Notes 2 and 3)
1.75
NST489AMT1
TSSOP−6
3,000 /
Tape & Reel
Junction and Storage
Temperature Range
T , T
−55 to +150
C
J
stg
NST489AMT1G
TSSOP−6
(Pb−Free)
3,000 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NSVT489AMT1G TSSOP−6
(Pb−Free)
3,000 /
Tape & Reel
2
1. FR−4 with 1 oz and 3.9 mm of copper area.
2
2. FR−4 with 1 oz and 645 mm of copper area.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
3. Refer to Figure 8.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 8
NST489AMT1/D