NSR0240V2T1G,
NSVR0240V2T1G
Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage
drop and low leakage current and are used in a wide range of dc−dc
converter, clamping and protection applications in portable devices.
NSR0240V2 in a SOD−523 miniature package enables designers to
meet the challenging task of achieving higher efficiency and meeting
reduced space requirements.
http://onsemi.com
40 VOLT SCHOTTKY
BARRIER DIODE
Features
• Very Low Forward Voltage Drop − 480 mV @ 100 mA
• Low Reverse Current − 0.2 mA @ 25 V VR
• 250 mA of Continuous Forward Current
• Power Dissipation of 200 mW with Minimum Trace
• Very High Switching Speed
SOD−523
CASE 502
• Low Capacitance − CT = 4 pF
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
1
CATHODE
2
ANODE
MARKING DIAGRAM
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
AC MG
G
• LCD and Keypad Backlighting
• Camera Photo Flash
• Buck and Boost dc−dc Converters
• Reverse Voltage and Current Protection
• Clamping & Protection
1
2
AC = Device Code
M
G
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation position may vary depending
upon manufacturing location.
Markets
• Mobile Handsets
• MP3 Players
• Digital Camera and Camcorders
• Notebook PCs & PDAs
• GPS
ORDERING INFORMATION
†
Device
Package
Shipping
NSR0240V2T1G
SOD−523
(Pb−Free)
3,000 /
Tape & Reel
MAXIMUM RATINGS
NSVR0240V2T1G
NSR0240V2T5G
SOD−523
(Pb−Free)
3,000 /
Tape & Reel
Rating
Symbol
Value
Unit
Reverse Voltage
V
R
40
Vdc
SOD−523
(Pb−Free)
5,000 /
Tape & Reel
Forward Continuous Current (DC)
I
F
250
2.0
mA
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Non−Repetitive Peak Forward Surge Current
I
FSM
ESD Rating: Human Body Model
Machine Model
ESD
Class 2
Class A
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
September, 2014 − Rev. 3
NSR0240V2T1/D