NSR02L30NXT5G
Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current. The DSN2 (Dual Silicon
No−lead) package is a chip level package using solderable metal
contacts under the package similar to DFN style packages. The DSN
style package enables 100% utilization of the package area for active
silicon, offering a significant performance per board area advantage
compared to products in plastic molded packages. The low thermal
resistance enables designers to meet the challenging task of achieving
higher efficiency and meeting reduced space requirements.
http://onsemi.com
30 V SCHOTTKY
BARRIER DIODE
Features
1
2
• Very Low Forward Voltage Drop − 400 mV @ 10 mA
• Low Reverse Current − 0.20 mA @ 10 V VR
CATHODE
ANODE
• 200 mA of Continuous Forward Current
• Power Dissipation of 312 mW with Minimum Trace
• ESD Rating − Human Body Model: Class 3B
ESD Rating − Machine Model: Class C
• Very High Switching Speed
MARKING
DIAGRAM
PIN 1
DSN2
(0201)
CASE 152AA
I230
YYY
• Low Capacitance − CT = 7 pF
• This is a Halide−Free Device
• This is a Pb−Free Device
I230
YYY
= Specific Device Code
= Year Code
Typical Applications
• LCD and Keypad Backlighting
• Camera Photo Flash
ORDERING INFORMATION
Device
NSR02L30NXT5G
Package
Shipping†
5000 / Tape & Reel
• Buck and Boost dc−dc Converters
• Reverse Voltage and Current Protection
• Clamping & Protection
DSN2
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Markets
• Mobile Handsets
• MP3 Players
• Digital Camera and Camcorders
• Notebook PCs & PDAs
• GPS
MAXIMUM RATINGS
Rating
Symbol
Value
30
Unit
V
Reverse Voltage
V
R
Forward Current (DC)
Forward Surge Current
I
200
mA
A
F
I
FSM
(60 Hz @ 1 cycle)
4.0
ESD Rating:
Human Body Model
Machine Model
ESD
>8.0
>400
kV
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
September, 2010 − Rev. 2
NSR02L30/D