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NSBC1XXXDXV6T5G PDF预览

NSBC1XXXDXV6T5G

更新时间: 2024-01-14 18:44:41
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
9页 82K
描述
Dual Bias Resistor Transistors

NSBC1XXXDXV6T5G 数据手册

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NSBC114EDXV6T1,  
NSBC114EDXV6T5  
Preferred Devices  
Dual Bias Resistor  
Transistors  
NPN Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
http://onsemi.com  
The BRT (Bias Resistor Transistor) contains a single transistor with  
a monolithic bias network consisting of two resistors; a series base  
resistor and a base−emitter resistor. These digital transistors are  
designed to replace a single device and its external resistor bias  
network. The BRT eliminates these individual components by  
integrating them into a single device. In the NSBC114EDXV6T1  
series, two BRT devices are housed in the SOT−563 package which is  
ideal for low power surface mount applications where board space is at  
a premium.  
(3)  
Q
(2)  
(1)  
R
R
2
1
1
Q
2
R
2
R
1
(4)  
(5)  
(6)  
NSBC114EDXV6T1  
Features  
Simplifies Circuit Design  
Reduces Board Space  
Reduces Component Count  
Lead−Free Solder Plating  
These are Pb−Free Devices  
MARKING  
DIAGRAM  
SOT−563  
CASE 463A  
PLASTIC  
xx M G  
MAXIMUM RATINGS  
(T = 25°C unless otherwise noted, common for Q and Q )  
A
1
1
1
2
Rating  
Symbol  
Value  
Unit  
Vdc  
Collector-Base Voltage  
V
50  
50  
xx = Device Code (Refer to Page 2)  
CBO  
M
= Date Code  
Collector-Emitter Voltage  
Collector Current  
V
Vdc  
CEO  
G
= Pb−Free Package  
I
100  
mAdc  
C
THERMAL CHARACTERISTICS  
ORDERING INFORMATION  
Characteristic  
(One Junction Heated)  
Symbol  
Max  
Unit  
Device  
Package  
Shipping  
Total Device Dissipation; T = 25°C  
P
357 (Note 1)  
2.9 (Note 1)  
mW  
mW/°C  
A
D
NSBC1xxxDXV6T1 SOT−563* 4000/Tape & Reel  
NSBC1xxxDXV6T1G SOT−563* 4000/Tape & Reel  
NSBC1xxxDXV6T5 SOT−563* 8000/Tape & Reel  
NSBC1xxxDXV6T5G SOT−563* 8000/Tape & Reel  
Derate above 25°C  
Thermal Resistance, Junction-to-Ambient  
R
q
350 (Note 1)  
°C/W  
JA  
Characteristic  
(Both Junctions Heated)  
Symbol  
Max  
Unit  
Total Device Dissipation; T = 25°C  
P
500 (Note 1)  
4.0 (Note 1)  
mW  
mW/°C  
A
D
Derate above 25°C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Thermal Resistance, Junction-to-Ambient  
R
q
250 (Note 1)  
−55 to +150  
°C/W  
°C  
JA  
Junction and Storage Temperature  
Range  
T , T  
J stg  
*This package is inherently Pb−Free.  
1. FR−4 @ Minimum Pad  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking table  
on page 2 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
May, 2006 − Rev. 6  
NSBC114EDXV6/D  
 

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