NLAS4717EPMTR2G

更新时间： 2024-09-13 03:46:23

品牌	Logo	应用领域
安森美 - ONSEMI		开关光电二极管
页数	文件大小	规格书
10页	88K
描述
4.5 ohm High Bandwidth, Dual SPDT Analog Switch

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数据手册

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NLAS4717EPMTR2G 数据手册

NLAS4717EP

4.5 W High Bandwidth, Dual

SPDT Analog Switch

The NLAS4717EP is an advanced CMOS analog switch fabricated

in sub−micron silicon gate CMOS technology. The device is a dual

independent Single Pole Double Throw (SPDT) switch featuring low

http://onsemi.com

MARKING

DS(on)

of 4.5 ꢀ at 3.0 V.

The device also features guaranteed Break−Before−Make (BBM)

switching, assuring the switches never short the driver.

The NLAS4717EP is available in two small size packages:

Microbump: 2.0 x 1.5 mm

DIAGRAMS

WQFN−10: 1.4 x 1.8 mm

4717EP

AYWWG

Features

Microbump−10

CASE 489AA

• Low R : 4.5 ꢀ @ 3.0 V

DS(on)

• Matching Between the Switches 0.5

• Wide Voltage Range: 1.8 V to 5.5 V

• High Bandwidth > 90 MHz

ꢀ

= Assembly Location

= Year

W, WW = Work Week

= Pb−Free Package

• 1.65 V to 5.5 V Operating Range

(Note: Microdot may be in either location)

• Low Threshold Voltages on Pins 4 and 8 (CTRL Pins)

• Ultra−Low Charge Injection ≤ 6.0 pC

AWMG

• Low Standby Current: I = 1.0 nA (Max) @ T = 25°C

• *OVT on Pins 4 and 8 (CTRL Logic Pins)

WQFN−10

CASE 488AQ

• These are Pb−Free Devices

= Specific Device Code

= Date Code

= Pb−Free Device

Typical Applications

• Cell Phones

• PDAs

(Note: Microdot may be in either location)

• MP3s

• Digital Still Cameras

• USB 2.0 Full Speed (USB1.1) − 12 Mbps Compliant

FUNCTION TABLE

IN_

NO_

NC_

OFF

Important Information

OFF

• ESD Protection:

HBM = 2500 V, MM = 200 V

• Latchup Max Rating: 200 mA (Per JEDEC EIA/JESD78)

• Pin−to−Pin Compatible with MAX4717

ORDERING INFORMATION

†

Device

Package

Shipping

*OVT

NLAS4717EPFCT1G Microbump−10

(Pb−Free)

3000 /

Tape & Reel

• Overvoltage Tolerant (OVT) specific pins operate higher than normal

supply voltages, with no damage to the devices or to signal integrity.

NLAS4717EPMTR2G WQFN−10

(Pb−Free)

3000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

March, 2006 − Rev. 5

NLAS4717EP/D

12 3 4 5 6 7...10

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