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MTP2P50E_10 PDF预览

MTP2P50E_10

更新时间: 2024-09-09 12:27:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 193K
描述
Power MOSFET 2 Amps, 500 Volts

MTP2P50E_10 数据手册

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MTP2P50E  
Power MOSFET  
2 Amps, 500 Volts  
PChannel TO220  
This high voltage MOSFET uses an advanced termination scheme  
to provide enhanced voltageblocking capability without degrading  
performance over time. In addition, this Power MOSFET is designed  
to withstand high energy in the avalanche and commutation modes.  
The energy efficient design also offers a draintosource diode with a  
fast recovery time. Designed for high voltage, high speed switching  
applications in power supplies, converters and PWM motor controls,  
these devices are particularly well suited for bridge circuits where  
diode speed and commutating safe operating areas are critical and  
offer additional safety margin against unexpected voltage transients.  
http://onsemi.com  
2 AMPERES, 500 VOLTS  
RDS(on) = 6 W  
PChannel  
D
Features  
Robust High Voltage Termination  
Avalanche Energy Specified  
G
SourcetoDrain Diode Recovery Time Comparable to a Discrete  
Fast Recovery Diode  
S
Diode is Characterized for Use in Bridge Circuits  
I  
and V  
Specified at Elevated Temperature  
MARKING DIAGRAM  
AND PIN ASSIGNMENT  
DSS  
DS(on)  
This is a PbFree Device*  
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
Drain  
4
C
Rating  
DrainSource Voltage  
Symbol  
Value  
500  
Unit  
Vdc  
Vdc  
V
DSS  
DGR  
DrainGate Voltage (R = 1.0 MW)  
V
V
500  
GS  
TO220AB  
CASE 221A  
STYLE 5  
MTP  
2P50EG  
AYWW  
GateSource Voltage  
Continuous  
V
GS  
20  
40  
Vdc  
Vpk  
NonRepetitive (t 10 ms)  
p
GSM  
1
Drain Current Continuous  
I
I
2.0  
1.6  
6.0  
Adc  
Apk  
D
D
2
Drain Current Continuous @ 100°C  
3
Drain Current Single Pulse (t 10 ms)  
I
p
DM  
1
3
Gate  
Source  
Total Power Dissipation  
Derate above 25°C  
P
D
75  
0.6  
W
W/°C  
2
Drain  
Operating and Storage Temperature Range  
T , T  
55 to 150  
°C  
J
stg  
MTP2P50E = Device Code  
Single Pulse DraintoSource Avalanche  
E
AS  
80  
mJ  
A
= Assembly Location  
Energy Starting T = 25°C  
J
Y
= Year  
(V = 100 Vdc, V = 10 Vdc,  
DD  
GS  
WW  
G
= Work Week  
= PbFree Package  
I = 4.0 Apk, L = 10 mH, R = 25 W)  
L
G
Thermal Resistance  
JunctiontoCase  
JunctiontoAmbient  
°C/W  
°C  
R
R
1.67  
62.5  
q
JC  
JA  
q
ORDERING INFORMATION  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 sec  
T
260  
L
Device  
MTP2P50EG  
Package  
Shipping  
50 Units/Rail  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
TO220AB  
(PbFree)  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
May, 2010 Rev. 6  
MTP2P50E/D  

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