MTP2P50E
Power MOSFET
2 Amps, 500 Volts
P−Channel TO−220
This high voltage MOSFET uses an advanced termination scheme
to provide enhanced voltage−blocking capability without degrading
performance over time. In addition, this Power MOSFET is designed
to withstand high energy in the avalanche and commutation modes.
The energy efficient design also offers a drain−to−source diode with a
fast recovery time. Designed for high voltage, high speed switching
applications in power supplies, converters and PWM motor controls,
these devices are particularly well suited for bridge circuits where
diode speed and commutating safe operating areas are critical and
offer additional safety margin against unexpected voltage transients.
http://onsemi.com
2 AMPERES, 500 VOLTS
RDS(on) = 6 W
P−Channel
D
Features
• Robust High Voltage Termination
• Avalanche Energy Specified
G
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
S
• Diode is Characterized for Use in Bridge Circuits
• I
and V
Specified at Elevated Temperature
MARKING DIAGRAM
AND PIN ASSIGNMENT
DSS
DS(on)
• This is a Pb−Free Device*
4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
Drain
4
C
Rating
Drain−Source Voltage
Symbol
Value
500
Unit
Vdc
Vdc
V
DSS
DGR
Drain−Gate Voltage (R = 1.0 MW)
V
V
500
GS
TO−220AB
CASE 221A
STYLE 5
MTP
2P50EG
AYWW
Gate−Source Voltage
− Continuous
V
GS
20
40
Vdc
Vpk
− Non−Repetitive (t ≤ 10 ms)
p
GSM
1
Drain Current − Continuous
I
I
2.0
1.6
6.0
Adc
Apk
D
D
2
Drain Current − Continuous @ 100°C
3
Drain Current − Single Pulse (t ≤ 10 ms)
I
p
DM
1
3
Gate
Source
Total Power Dissipation
Derate above 25°C
P
D
75
0.6
W
W/°C
2
Drain
Operating and Storage Temperature Range
T , T
−55 to 150
°C
J
stg
MTP2P50E = Device Code
Single Pulse Drain−to−Source Avalanche
E
AS
80
mJ
A
= Assembly Location
Energy − Starting T = 25°C
J
Y
= Year
(V = 100 Vdc, V = 10 Vdc,
DD
GS
WW
G
= Work Week
= Pb−Free Package
I = 4.0 Apk, L = 10 mH, R = 25 W)
L
G
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
°C/W
°C
R
R
1.67
62.5
q
JC
JA
q
ORDERING INFORMATION
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 sec
T
260
L
Device
MTP2P50EG
Package
Shipping
50 Units/Rail
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
TO−220AB
(Pb−Free)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
May, 2010 − Rev. 6
MTP2P50E/D