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MMDT4146_09 PDF预览

MMDT4146_09

更新时间: 2024-09-22 10:51:59
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
5页 90K
描述
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

MMDT4146_09 数据手册

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MMDT4146  
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR  
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Mechanical Data  
Features  
Complementary Pair  
One 4124-Type NPN  
One 4126-Type PNP  
Case: SOT-363  
Case Material: Molded Plastic, “Green” Molding Compound,  
Note 5. UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe  
(Lead Free Plating) Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Marking Information: See Page 4  
Ordering Information: See Page 4  
Weight: 0.006 grams (approximate)  
Epitaxial Planar Die Construction  
Ideal for Medium Power Amplification and Switching  
Ultra-Small Surface Mount Package  
Lead Free/RoHS Compliant (Note 3)  
"Green" Device (Note 4 and 5)  
C2  
B1  
E1  
E1, B1, C1 = PNP4126 Section  
E2, B2, C2 = NPN4124 Section  
E2  
B2  
C1  
Top View  
Device Schematic  
Maximum Ratings, NPN 4124 Section @TA = 25°C unless otherwise specified  
Characteristic  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Value  
30  
Unit  
V
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
25  
V
5.0  
V
Collector Current – Continuous  
(Note 1)  
200  
mA  
Maximum Ratings, PNP 4126 Section @TA = 25°C unless otherwise specified  
Characteristic  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Value  
-25  
Unit  
V
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
-25  
V
-4  
V
Collector Current - Continuous  
(Note 1)  
-200  
mA  
Thermal Characteristics – Total Device  
Characteristic  
Symbol  
PD  
Value  
200  
Unit  
mW  
Power Dissipation  
(Note 1, 2)  
(Note 1)  
Thermal Resistance, Junction to Ambient  
625  
°C/W  
Rθ  
JA  
Notes:  
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which  
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.  
2. Maximum combined dissipation.  
3. No purposefully added lead.  
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
1 of 5  
www.diodes.com  
January 2009  
© Diodes Incorporated  
MMDT4146  
Document number: DS30162 Rev. 11 - 2  

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