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MMBTA92 PDF预览

MMBTA92

更新时间: 2024-10-29 05:49:23
品牌 Logo 应用领域
美微科 - MCC 晶体晶体管开关光电二极管高压
页数 文件大小 规格书
3页 134K
描述
PNP Silicon High Voltage Transistor

MMBTA92 数据手册

 浏览型号MMBTA92的Datasheet PDF文件第2页浏览型号MMBTA92的Datasheet PDF文件第3页 
M C C  
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20736 Marilla Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
MMBTA92  
Features  
Surface Mount SOT-23 Package  
Capable of 300mWatts of Power Dissipation  
PNP Silicon High  
Voltage Transistor  
Case Material:Molded Plastic. UL Flammability  
Classificatio Rating 94-0 and MSL Rating 1  
x
Marking:2D  
SOT-23  
Electrical Characteristics @ 25OC Unless Otherwise Specified  
A
Symbol  
Parameter  
Min  
Max  
Units  
D
OFF CHARACTERISTICS  
C
V(BR)CEO  
V(BR)CBO  
V(BR)EBO  
Collector-Emitter Breakdown Voltage*  
(IC=-1.0mAdc, IB=0)  
Collector-Base Breakdown Voltage  
(IC=-100µAdc, IE=0)  
Emitter-Base Breakdown Voltage  
(IE=-100µAdc, IC=0)  
-300  
-300  
-5  
Vdc  
Vdc  
Vdc  
B
C
E
B
F
E
IC  
Collector Current-Continuous  
-300  
mAdc  
nAdc  
ICBO  
Collector Cutoff Current  
(VCB=-200Vdc, IE=0)  
Emitter Cutoff Current  
(VEB=-5Vdc, IC=0)  
-250  
-100  
H
G
IEBO  
nAdc  
K
ON CHARACTERISTICS  
DIMENSIONS  
hFE  
DC Current Gain*  
INCHES  
MIN  
MM  
(IC=-1.0mAdc, VCE=-10Vdc)  
(IC=-10mAdc, VCE=-10Vdc)  
(IC=-30mAdc, VCE=-10Vdc)  
Collector-Emitter Saturation Voltage  
(IC=-20mAdc, IB=-2.0mAdc)  
60  
100  
60  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
NOTE  
200  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
VCE(sat)  
VBE(sat)  
-0.2  
-0.9  
Vdc  
Vdc  
Base-Emitter Saturation Voltage  
(IC=-20mAdc,IB=-2.0mAdc)  
F
G
H
J
SMALL-SIGNAL CHARACTERISTICS  
.085  
.37  
K
fT  
Current Gain-Bandwidth Product  
(IC=-10mAdc, VCE=-20Vdc, f=30MHz)  
Collector-Base Capacitance  
(VCB=-20Vdc, IE=0, f=1.0MHz)  
50  
MHz  
pF  
Ccb  
6.0  
Suggested Solder  
Pad Layout  
THERMAL CHARACTERISTICS  
.031  
.800  
Characteristic  
Symbol  
Max  
Unit  
(1)  
Total Device Dissipation FR–5 Board,  
P
225  
mW  
D
.035  
.900  
T
= 25°C  
A
Derate above 25°C  
1.8  
556  
300  
mW/°C  
°C/W  
mW  
.079  
inches  
2.000  
mm  
Thermal Resistance, Junction to Ambient  
R
qJA  
Total Device Dissipation  
(2)  
P
D
Alumina Substrate,  
T = 25°C  
A
.037  
.950  
Derate above 25°C  
2.4  
mW/°C  
°C/W  
°C  
.037  
.950  
Thermal Resistance, Junction to Ambient  
Junction and Storage Temperature  
R
417  
qJA  
T , T  
J stg  
–55 to +150  
www.mccsemi.com  
1 of 3  
Revision: 5  
2009/06/10  

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