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MMBTA63LT1G_09 PDF预览

MMBTA63LT1G_09

更新时间: 2024-11-21 05:49:23
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管达林顿晶体管
页数 文件大小 规格书
4页 122K
描述
Darlington Transistors

MMBTA63LT1G_09 数据手册

 浏览型号MMBTA63LT1G_09的Datasheet PDF文件第2页浏览型号MMBTA63LT1G_09的Datasheet PDF文件第3页浏览型号MMBTA63LT1G_09的Datasheet PDF文件第4页 
MMBTA63LT1G,  
MMBTA64LT1G  
Darlington Transistors  
PNP Silicon  
http://onsemi.com  
Features  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
COLLECTOR 3  
Compliant  
BASE  
1
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Value  
30  
Unit  
Vdc  
EMITTER 2  
V
CES  
CBO  
EBO  
3
V
V
30  
Vdc  
10  
Vdc  
1
2
Collector Current Continuous  
I
C
500  
mAdc  
SOT23 (TO236)  
CASE 318  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
STYLE 6  
Total Device Dissipation FR5 Board,  
P
D
(Note 1) T = 25°C  
225  
1.8  
mW  
mW/°C  
MARKING DIAGRAM  
A
Derate above 25°C  
Thermal Resistance, JunctiontoAmbient  
R
556  
°C/W  
q
JA  
2x M G  
Total Device Dissipation  
P
D
G
Alumina Substrate, (Note 2)  
1
T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Derate above 25°C  
2x = Device Code  
Thermal Resistance, JunctiontoAmbient  
Junction and Storage Temperature  
R
417  
°C/W  
°C  
q
JA  
x = U for MMBTA63LT1  
x = V for MMBTA64LT1  
T , T  
J
55 to +150  
stg  
M
G
= Date Code*  
= PbFree Package  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 x 0.75 x 0.062 in.  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MMBTA63LT1G  
SOT23 3,000 / Tape & Reel  
(PbFree)  
MMBTA64LT1G  
SOT23 3,000 / Tape & Reel  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
August, 2009 Rev. 4  
MMBTA63LT1/D  
 

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