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MMBT2222LT1G PDF预览

MMBT2222LT1G

更新时间: 2024-11-17 21:54:39
品牌 Logo 应用领域
安森美 - ONSEMI 晶体小信号双极晶体管开关光电二极管PC
页数 文件大小 规格书
8页 129K
描述
General Purpose Transistors

MMBT2222LT1G 技术参数

是否无铅:不含铅生命周期:Active
零件包装代码:SOT-23包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:0.46Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:225759
Samacsys Pin Count:3Samacsys Part Category:Transistor
Samacsys Package Category:SOT23 (3-Pin)Samacsys Footprint Name:SOT-23 (TO-236) CASE 318-08 ISSUE AR
Samacsys Released Date:2015-08-13 08:20:52Is Samacsys:N
最大集电极电流 (IC):0.6 A集电极-发射极最大电压:30 V
配置:SINGLE最小直流电流增益 (hFE):75
JEDEC-95代码:TO-236JESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:NPN
最大功率耗散 (Abs):0.225 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
标称过渡频率 (fT):250 MHz最大关闭时间(toff):285 ns
最大开启时间(吨):35 nsBase Number Matches:1

MMBT2222LT1G 数据手册

 浏览型号MMBT2222LT1G的Datasheet PDF文件第2页浏览型号MMBT2222LT1G的Datasheet PDF文件第3页浏览型号MMBT2222LT1G的Datasheet PDF文件第4页浏览型号MMBT2222LT1G的Datasheet PDF文件第5页浏览型号MMBT2222LT1G的Datasheet PDF文件第6页浏览型号MMBT2222LT1G的Datasheet PDF文件第7页 
MMBT2222LT1,  
MMBT2222ALT1  
MMBT2222ALT1 is a Preferred Device  
General Purpose  
Transistors  
NPN Silicon  
http://onsemi.com  
Features  
COLLECTOR  
3
Pb−Free Package May be Available. The G−Suffix Denotes a  
Pb−Free Lead Finish  
1
MAXIMUM RATINGS  
BASE  
Rating  
Symbol  
Value  
Unit  
2
CollectorEmitter Voltage  
V
CEO  
V
CBO  
V
EBO  
Vdc  
EMITTER  
30  
40  
MMBT2222LT1  
MMBT2222ALT1  
MARKING  
DIAGRAM  
CollectorBase Voltage  
Vdc  
Vdc  
60  
75  
3
MMBT2222LT1  
MMBT2222ALT1  
1
EmitterBase Voltage  
2
5.0  
6.0  
MMBT2222LT1  
MMBT2222ALT1  
xxx  
M
SOT−23  
CASE 318  
Style 6  
Collector Current − Continuous  
I
C
600  
mAdc  
THERMAL CHARACTERISTICS  
Characteristic  
xxx = Specific Device Code  
Symbol  
Max  
Unit  
= (M1B = MMBT2222LT1,  
= 1P = MMBT2222ALT1)  
= Date Code  
Total Device Dissipation  
FR5 Board (Note 1)  
P
D
225  
mW  
M
T = 25°C  
Derate above 25°C  
A
1.8  
mW/°C  
°C/W  
ORDERING INFORMATION  
Thermal Resistance  
Junction−to−Ambient  
R
556  
q
JA  
Device  
Package  
Shipping  
Total Device Dissipation  
P
D
300  
mW  
MMBT2222LT1  
SOT−23 3000/Tape & Reel  
Alumina Substrate (Note 2)  
MMBT2222LT1G  
SOT−23 3000/Tape & Reel  
(Pb−Free)  
T = 25°C  
A
2.4  
mW/°C  
°C/W  
Derate above 25°C  
Thermal Resistance  
Junction−to−Ambient  
R
417  
MMBT2222ALT1  
SOT−23 3000/Tape & Reel  
q
JA  
MMBT2222ALT1G SOT−23 3000/Tape & Reel  
(Pb−Free)  
Junction and Storage  
Temperature Range  
T , T  
J
55 to  
+150  
°C  
stg  
MMBT2222LT3  
MMBT2222ALT3  
SOT−23 10,000/Tape & Reel  
SOT−23 10,000/Tape & Reel  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
MMBT2222ALT3G SOT−23 10,000/Tape & Reel  
(Pb−Free)  
1. FR5 = 1.0 0.75 0.062 in.  
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
September, 2004 − Rev. 5  
MMBT2222LT1/D  
 

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